Abstract: A substrate and method of manufacture wherein a substrate is molded from particulate material wherein grooves on and through the body are formed during substrate molding and prior to sintering. The substrate includes all buss structure molded therein. Cooling of chips is provided by providing a heat sink in grooves formed within a substrate and beneath the chips. Microcircuits are formed by disposing on the substrate and interconnecting via buss structures on the substrate various semiconductor dies with encapsulation of some or all of the substrates and components thereon, if desired. In addition, connection from the board to external circuits is available by means of an edge connector.

Abstract: The disclosure relates to a method whereby complex shapes, not moldable in a single molding operation, are molded in plural parts, each part being of the same or different powdered metal composition or prealloy of the type disclosed. One or more of the parts preferably has bumps or dimples thereon for joining to another of the parts in the manner to be described. The other part can also have depressions for receiving the bumps to aid in alignment of the parts prior to processing.

Abstract: The disclosure relates to a system for removing binder from "green" bodies wherein debinding action takes place substantially uniformly throughout the sytem for large load as well as for small loads. This result is obtained by providing a plurality of shelves for holding the parts and providing turbulent atmosphere flow across all shelves with recirculation taking palce over a water fall in the system to provide both a water saturated atmosphere and removal of binder from the atmosphere and system simultaneously.

Abstract: The disclosure relates to a method of rapidly removing binder from a "green" body composed of metal or cermet fine particles and a carbon-containing binder wherein the debinderizing step is performed in a water saturated atmosphere to provide chemical reaction with elemental carbon, the reaction products being removed from the system.

Abstract: The disclosure relates to a feedstock of particulate material for use in formation of articles therefrom, the feedstock including a homogeneous combination of large particles, small particles and a binder. The large particles comprise less than about 60% by volume of the feedstock and are defined as particles having a diameter greater than their diffusion length. The fine particles and binder combined comprise more than about 40% by volume of the feedstock, the fine particles being defined as particles having a diameter less than their diffusion length.