Abstract: An ion source includes a magnetic field portion and an electrode. The magnetic field portion has an open side directing toward a workpiece and a closed side. An inner magnetic pole and an outer magnetic pole are disposed to be spaced apart from each other at the open side and the closed side is connected to a magnetic core, so that an accelerating closed loop of plasma electrons is formed at the open side. The inner magnetic pole has a gas injection portion configured to supply gas toward the accelerating closed loop. The electrode is disposed at a lower portion of the acceleration closed loop with being spaced apart from the magnetic field portion.
Abstract: An ion beam source includes a magnetic field unit including a first side facing a target object to be treated and a second side, where the first side is opened and the second side is closed, and the first side includes a plurality of magnetic pole portions arranged at predetermined intervals with an N-pole and an S-pole alternatively or with same magnetic poles and configured to form a closed loop of plasma electrons and an electrode unit arranged at a lower end of the closed loop. The ion beam source is configured to rotate the plasma electrons within a process chamber along the closed loop, to generate plasma ions from an internal gas within the process chamber, and to provide the plasma ions to the target object.
Abstract: An ion beam source includes a magnetic field unit including a first side facing a target object to be treated and a second side, where the first side is opened and the second side is closed, and the first side includes a plurality of magnetic pole portions arranged at predetermined intervals with an N-pole and an S-pole alternatively or with same magnetic poles and configured to form a closed loop of plasma electrons and an electrode unit arranged at a lower end of the closed loop. The ion beam source is configured to rotate the plasma electrons within a process chamber along the closed loop, to generate plasma ions from an internal gas within the process chamber, and to provide the plasma ions to the target object.