Abstract: A transmitter is disclosed including a laser array comprising a plurality of lasers spatially offset from one another and each having a laser output having a unique wavelength. A first prism is positioned to impart a first angular shift to the laser outputs to produce and a second prism is positioned to impart a second angular shift opposite the first angular shift on the outputs. An index modulating element is coupled to one of the first and second prisms and a controller is electrically coupled to the index modulating element to control an angle of light output form the second prism. An optical spectrum reshaper may be positioned between the second prism and the lens and have at least one transmission edge aligned with the wavelength at least one of the lasers.

Abstract: An apparatus for use in an optical transceiver module that incorporates an integrated multiplexer/demultiplexer for high speed data transfer applications. One example embodiment includes a transmissive block arranged to interface with a transmit optical port, a receive optical port, and a plurality of optical subassemblies. The transmit optical port may transmit a first multiplexed optical signal and the receive optical port may receive a second multiplexed optical signal. Filters may be positioned between the transmissive block and one or more of the optical subassemblies to transmit signals at predetermined wavelengths while reflecting other signals incident thereon.

Abstract: An electromagnetic radiation containment system is provided for use in connection with functional modules and an associated card cage disposed in the chassis of an electronic equipment enclosure. The electromagnetic radiation containment system includes conductive elements uniformly distributed about the perimeter of a functional module configured to be received within the card cage, and further includes grounding elements in electrical communication with the chassis so that when the functional module is positioned within a slot of the card cage, at least some of the conductive elements are in electrical communication with the grounding elements. The uniform distribution of the conductive elements on the functional module(s) enables the functional modules to be arranged above and below each other, as well as side by side, without compromising the electromagnetic radiation containment functionality that is afforded when each of the slots of the card cage is occupied.

Abstract: A photonic device package with a passively aligned lens cap is disclosed. The lens cap is positioned with an unobstructed view of the lens portion of the lens cap. A header holding a photonic device, is moved relative to the cap or vice versa until the video display system indicates that the photonic device is aligned to the lens. The cap is held in alignment by forming at least one weld point between the cap and the header. A subsequent hermetic sealing process can be used to permanently seal the cap to the header.

Abstract: Systems and methods use single-fiber optical add/drop multiplexers (OADMs) to enable bi-directional data transmission in WDM systems over a single fiber. By reducing the required capacity for an optical network from dual fibers to a single fiber, significant cost and bandwidth efficiencies are achieved. The systems and methods also provide redundancy protection in single-fiber bidirectional line ring systems. In the event of a downstream fiber or device failure, the OADM module receives a signal on a first wavelength from a first direction, shifts the signal from the first wavelength to a second wavelength, and sends the signal back down the fiber it originated from on the second wavelength, thus maintaining the propagation of the signal in the ring system.

Abstract: Embodiments of the present invention are directed to high density arrays of optical transceiver modules. A first fabricated package includes a light source and/or light detector, a first surface with at least one opening for transferring optical signals, and a second opposing surface. A second fabricated package has an opening for accepting a component insert and is oriented such that the length of the second fabricated package is essentially perpendicular to the second opposing surface. A lead frame mechanically connects the first fabricated package and the second fabricated package and electrically connects the light source and/or light detector in the first fabricated package to contacts exposed in the opening of the second fabricated package. A component insert is mechanically coupled to the second fabricated package and electrically coupled to the exposed contacts such that components of the component insert can electrically interoperate with the light source and/or light detector.

Abstract: An eye safety mechanism for use with a bi-directional data cable having an electrical interface at least one (but potentially both) ends, despite the fact that the cable communicates over much of its length using a bi-directional optical channel. Upon power-up, the eye safety mechanism determines whether or not a loss of signal condition is present on an optical receive channel of the bi-directional data cable. If the loss of signal is present, the mechanism intermittently disables the optical transmit channel of the bi-directional data cable. On the other hand, if the loss of signal is not present, the mechanism enables the optical transmit channel of the bi-directional data cable without intermittently disabling transmission at least for most of the time until the next time a loss of signal is detected on the optical receive channel.

Abstract: A linear transimpedance amplifier includes a forward transimpedance circuit that receives an input signal from an optical device. The forward transimpedance circuit generates a linear output signal. The forward transimpedance circuit includes a first gain path and a second gain path, the first gain path configured to amplify the input signal when the first gain path is at a lower input impedance relative to the second gain path and the second gain path configured to amplify the input signal when the second gain path is at a lower input impedance relative to the first gain path. A feedback circuit includes a first circuit that detects a low frequency component of the output signal.

Abstract: A transceiver module that utilizes an apparatus for providing chassis ground to a printed circuit board located within a connector structure of the transceiver module. In one example embodiment, a ground clip for use in a transceiver module includes a cross-arm, a pair of arms connected to the cross-arm, a pair of fingers each connected to one of the pair of arms, and at least one protrusion connected to the cross-arm. Each finger is configured to be inserted into a hole in a connector structure and configured to be electrically connected to ground contacts of a printed circuit board. The at least one protrusion is configured to bias against, and make reliable electrical contact with, a portion of a transceiver module that is electrically connected to a housing of the transceiver module.

Abstract: A cure oven comprises a sealable door and one or more pressure valves mounted inside for curing optical subcomponents that have been assembled using an adhesive. The cure oven comprises a chamber that can be configured to receive several hundreds of assembled optical subcomponents. The cure oven is further coupled to a computerized system via a drive motor. The computerized system initiates the heating and cooling sequences, and indicates whether the door can be opened, or must remain shut. The cure oven maintains a certain pressure inside the oven chamber consistent with a rise in temperature, allowing assembled optical subcomponents to be cured at a much higher rate than possible without disassembling, or being damaged.

Abstract: This disclosure concerns systems and devices configured to implement impedance matching schemes in a high speed data transmission environment. In one example, an electrical connection system is provided that includes a circuit board upon which are disposed a one or more signal contact pads, each of which is configured to communicate with a complementary element of an external electrical device such that a respective shunt capacitance is defined. One or more of the signal contact pads define at least one open portion through which communication signals cannot pass. The open portions of the one or more signal contact pads are configured to reduce a shunt capacitance that is defined at the coupling of each signal contact pad and corresponding connector. As well, one or more signal lines are likewise disposed on the circuit board such that each signal line is connected to a respective one of the signal contact pads. The circuit board finally includes one or more ground contact pads and power contact pads.

Abstract: A temperature-controlled system for testing a laser die mounted on a submount is disclosed. The testing system comprises a base having a motor-driven translation platform. The translation platform includes a first testing site having a two-stage temperature control system mounted on a base portion. The temperature control system includes a thermoelectric cooler and a fluid system for circulating a cooling/heating fluid in a circulation block. A mounting portion is also included on the first testing site on which the submount is positioned. The temperature of the mounting portion is controlled by the temperature control system. A probe card having an arm and an electrical contact portion attached to the arm provides a power supply to the submount when the first testing site is aligned with the probe card. An aligner having a lens assembly that is alignable with the first testing site receives an optical signal produced by the laser.

Abstract: A flexible circuit comprises a flexible substrate having first and second opposing surfaces. The flexible substrate can include multiple layers. A plurality of electrical traces can be mounted on either or both surfaces of the flexible substrate. A plurality of electrical components can also be mounted on either or both surfaces of the flexible substrate. A plurality of tooling cutouts is recessed in the sides of the flexible circuit. The tooling cutouts can have various shapes, such as, but not limited to, semi-circular, multiple straight edges, a single or multiple curved edges, etc. The cutouts are used to position and hold the flexible circuit in at least one other device.

Abstract: An active cable that is configured to communicate over much of its length using one or more optical fibers, and that includes an integrated electrical connector at at least one end. The active cable includes an integrated eye safety controls to thereby reduce the chance of injury should the active cable be severed, or otherwise unplugged at an optical end, if any. The cable may be an electrical to optical cable, and electrical to electrical cable, or one of many other potential configurations.

Abstract: An optical transceiver configured to perform calibration of digital diagnostics prior to providing the calibrated values to a host computing system (hereinafter referred to simply as a “host”) that is communicatively coupled to the optical transceiver. The optical transceiver includes a sensor that measures an analog operational parameter signal such as temperature or supply voltage. Each analog signal is then converted to digital samples by analog to digital converter(s). A processor executes microcode that causes the optical transceiver to perform calibration on the various samples to compensate for predictable error introduced into the analog signal prior to or during the analog-to-digital conversion. The optical transceiver may then make the calibrated result accessible to the host.

Abstract: An integrated cable configured to communicate over much of its length using one or more optical fibers includes an electrical connector at least one end. The electrical connector at a first end of the integrated cable and an optoelectronic device coupled to or included in the other end of the integrated cable may utilize a bidirectional status link to transmit status data to each other. If the status data indicates that optical signals transmitted over the optical channels between the two devices are not potentially exposed to view, the two devices may operate above nominal eye safety limits. Otherwise, the two devices may operate at or below nominal eye safety limits. If the second optoelectronic device is not status-link enabled, the first optoelectronic device may operate at or below nominal eye safety limits.

Abstract: Heating resistor used to control laser operation. A laser package, such as a Transmitter Optical Subassembly (TOSA) includes a substrate. A laser is disposed on the substrate. A resistive heating element is disposed on the substrate with the laser. Control circuitry is connected to the resistive heating element. The control circuitry is configured to cause current flow through the resistive heating element based on temperature conditions. Current flow through the resistive heating element causes an increase in the operating temperature of the laser. This can be used to increase the effective operating temperature range of a laser.

Abstract: An optical transceiver module is authenticated in a host system. A host generates a data string and writes the data string to a first predetermined memory location known to the transceiver. The data string is cryptographically altered (either encrypted or decrypted) by the transceiver and written to a second predetermined memory location known to the host. The host retrieves the cryptographically altered data string and performs a complementary cryptographic operation (either a decryption or encryption, respectively) thereon, creating a resulting data string. If the resulting data string is equal to the data string written to the first predetermined memory location, the transceiver is authenticated. The host and the transceiver may switch roles, with the transceiver generating the data string, the host cryptographically altering it, and so on. The host encrypts data strings when the transceiver decrypts data strings, and vice versa.

Abstract: A general method is given for screening laser diodes for electrostatic discharge, (ESD), damage. The laser diode may be selectively isolated from the laser driver so that a current-voltage (I-V), curve can be taken and then compared to curves taken previously on the same laser diode to ascertain the possibility of ESD damage. Presumably the initial I-V curve will be representative of the characteristics of that particular laser in the undamaged state. Such an initial curve may be supplied by the manufacturer and may be a curve specific to a particular laser diode. Comparison with a standard curve is not sufficient to determine ESD damage in the early stages of failure. Some embodiments focus on isolating the laser diode from the laser driver, storing the information locally in the transceiver, and providing some analysis resulting in flagging laser diodes showing changes that are indicative of ESD damage.

Abstract: Flexible printed circuit boards interconnect to adjacent electronic devices through one or more of high speed data, low speed data, high current, and ground lines and pads. The design of the high speed data pads and traces and adjacent ground pads and traces maintains a desired impedance in the flexible circuit and at the transition from the flexible circuit to a printed circuit board, a ceramic header, or other device to ensure high speed operation. The pads are preferably arranged in a two dimensional geometry such that a connecting area of the flexible circuit is narrower than it would preferably be if the pads were arranged linearly. The two dimensional array also allows the use of the high current thermoelectric cooler pads, which require large surface areas that may otherwise not fit in a conventional linear array.