Patents Assigned to FINNISH ENVIRONMENT TECHNOLOGY OY
  • METHOD IN MANUFACTURING OF CIRCUIT BOARDS
    Publication number: 20100146781
    Abstract: Method for connecting the conductive surfaces of circuit boards, especially a circuit board equipped with at least two conductive surfaces separated by an insulator layer and with holes, or for creating conductors on a board in a manner that conducts electricity. In the method, a metal or metal alloy, in a powder form, is fed into and the powder is sintered using a laser in order to create a unified conductive structure.
    Type: Application
    Filed: May 29, 2008
    Publication date: June 17, 2010
    Applicant: FINNISH ENVIRONMENT TECHNOLOGY OY
    Inventors: Antti Salminen, Rauno Holappa