Patents Assigned to First Light Technologies, Inc.
  • System and method for distributing a resin disposed between a top substrate and a bottom substrate
    Patent number: 6214412
    Abstract: A system and method distribute a resin disposed between a top substrate and a bottom substrate. Each substrate has a center hole, and the top and bottom substrates and the resin define an interior region. A top substrate assembly forms a seal over the center hole of the top substrate and creates a vacuum at the interior region. A bottom substrate assembly receives the top and bottom substrates with the resin disposed in-between. A spinning assembly causes the top and bottom substrates to spin according to a predetermined spin profile.
    Type: Grant
    Filed: May 19, 1998
    Date of Patent: April 10, 2001
    Assignee: First Light Technologies, Inc.
    Inventors: Joseph W. Paulus, Michael L. Cadorette, Arthur R. Leblanc, III, Scott R. Parent, Peter A. Whiteside, Elangovan Ramanathan