Abstract: A method includes patterning one or more electrical layers on a substrate; shaping the patterned substrate into a 3-dimensional contour, wherein the contour including a significant change in gradient in or adjacent to one or more sensing areas of the electrical layer, and over-molding the shaped substrate. Degradation of a trace in the electrical layer at or adjacent to the one or more sensing areas during shaping and/or over-molding is substantially minimized based on the width of the trace, the thickness or number of layers of the trace, the bending radius of the trace, the material of the trace, and/or a primer over layer on the trace.

Abstract: A method comprising: patterning one or more electrical layers on a substrate; shaping the patterned substrate into a 3-dimensional contour, wherein the contour including a significant change in gradient in or adjacent to one or more sensing areas of the electrical layer, and over-moulding the shaped substrate, wherein degradation of a trace in the electrical layer at or adjacent to the one or more sensing areas during shaping and/or over-moulding is substantially minimised based on the width of the trace, the thickness or number of layers of the trace, the bending radius of the trace, the material of the trace, and/or a primer over layer on the trace.