Abstract: A method for measuring shoe comfort level is provided. A 3D polygonal model of a foot is constructed from an array of images taken from multiple angles of the foot and leg. Each vertex point is loaded with foot anthropometric sensitive characteristics information. A 3D model of a shoe's inner space is constructed with a scanning device having various opening modes. Each of shoe inner space vertex points is complimented by shoe data such as material type, rigidity, structure, vamp and shoelaces. The 3D polygonal foot model and the vertex inner shoe space model are fitted together and the comfort level for the foot is defined with the simulation of movement.
Type:
Grant
Filed:
March 13, 2020
Date of Patent:
November 16, 2021
Assignee:
FITTIN, LLC
Inventors:
Andrej Anatolevich Revkov, Grigorij Vladimirovich Chujko, Ivan Sergeevich Shchedrin, Egor Andreevich Revkov
Abstract: A method for measuring shoe comfort level is provided. A 3D polygonal model of a foot is constructed from an array of images taken from multiple angles of the foot and leg. Each vertex point is loaded with foot anthropometric sensitive characteristics information. A 3D model of a shoe's inner space is constructed with a scanning device having various opening modes. Each of shoe inner space vertex points is complimented by shoe data such as material type, rigidity, structure, vamp and shoelaces. The 3D polygonal foot model and the vertex inner shoe space model are fitted together and the comfort level for the foot is defined with the simulation of movement.
Type:
Application
Filed:
March 13, 2020
Publication date:
November 19, 2020
Applicant:
FITTIN, LLC
Inventors:
ANDREJ ANATOLEVICH REVKOV, GRIGORIJ VLADIMIROVICH CHUJKO, IVAN SERGEEVICH SHCHEDRIN, EGOR ANDREEVICH REVKOV