Patents Assigned to Flavors Technology
  • Printed circuit board heat sink
    Patent number: 4979074
    Abstract: A heat sink for a printed circuit board in comprised of a thermally-conductive plate having on one surface a thermally-conductive, electrically-insulative elastomer layer which conformally engages at leasts a portion of the back surface of the printed circuit board. The ends of pins of electronic components mounted on the board and desired to be cooled embed into the elastomer layer to provide a conductive path for transfer of heat from the electronic components to the elastomer layer and then to the thermally-conductive plate.
    Type: Grant
    Filed: June 12, 1989
    Date of Patent: December 18, 1990
    Assignee: Flavors Technology
    Inventors: Richard E. Morley, David A. Baker