Abstract: A computer system especially for solution of real time inference problems is disclosed. The system includes a systolic cellular processor which provides predictable and responsive real time operation and fine grain programmability. The system comprises a plurality of separate processor cells each having its own local memory, the cells running simultaneously and operative to execute their respective program instructions. A global memory is coupled via a global bus to the processor cells and provides data to the cells and stores data from the cells. The bus provides effectively simultaneous access of all cells to the global memory. A further feature of the system is a novel parallel programming language using English syntax and which provides synchronous and predictable binding of code to each cell. A graphic work station is provided as a user interface to provide visual access to each cell or to cell groups for ease of control.

Abstract: A computer system especially for solution of real time inference problems is disclosed. The system includes a systolic cellular processor which provides predictable and responsive real time operation and fine grain programmability. The system comprises a plurality of separate processor cells each having its own local memory, the cells running simultaneously and operative to execute their respective program instructions. A global memory is coupled via a global bus to the processor cells and provides data to the cells and stores data from the cells. The bus provides effectively simultaneous access of all cells to the global memory. A further feature of the system is a novel parallel programming language using English syntax and which provides synchronous and predictable binding of code to each cell. A graphic work station is provided as a user interface to provide visual access to each cell or to cell groups for ease of control.

Abstract: A heat sink for a printed circuit board in comprised of a thermally-conductive plate having on one surface a thermally-conductive, electrically-insulative elastomer layer which conformally engages at leasts a portion of the back surface of the printed circuit board. The ends of pins of electronic components mounted on the board and desired to be cooled embed into the elastomer layer to provide a conductive path for transfer of heat from the electronic components to the elastomer layer and then to the thermally-conductive plate.