Abstract: An LED package structure comprises a 3D substrate, LED chips, wires, and resin encapsulants. The 3D substrate has a stepped contour and includes a first chip accommodation region and at least one second chip accommodation region surrounding the first chip accommodation region. A first electric contact and a second electric contact are arranged in the first chip accommodation region. The LED chips are arranged in the border of the 3D substrate. The wires are used to connect the LED chips in series or in series firstly and in parallel next. One of the wires connects the first electric contact and one of the LED chips. Another one of the wires connects the second electric contact and another one of the LED chips. The resin encapsulants respectively encapsulate the LED chips. The LED package structure is characterized in using a 3D substrate to facilitate wiring and increase the beam angle.

Abstract: A LED light bulb includes a light bulb adapter; a housing fixed on the light bulb adapter and having an accommodating space, wherein the housing has at least a vent hole; a convective heat dissipation piece including a first heat dissipation part and a second heat dissipation part connected under the first heat dissipation part; a light-emitting module disposed on a top surface of the convective heat dissipation piece; and a light bulb cover disposed on the top surface of the convective heat dissipation piece and covering the light-emitting module.