Abstract: The present invention is an improved wallboard joint compound comprising an inorganic joint compound such as, for example, gypsum, mixed with water, plus one or more additives selected to reduce the moisture in the gypsum compound and improve the strength of the finished wallboard joint. The first additive is selected from a class of water soluble functional polymer with either nitrogen or sulfonate, such as, for example, polyvinyl pyrrolidone (PVP). A second additive is selected from a class of solid epoxy resins, preferably added together with the first additive. These two additives, when mixed with the joint compound alone or in combination, produced a more flexible, higher strength wallboard with a reduce moisture content and quicker drying time.