Abstract: A technique comprising: providing an assembly temporarily adhered on opposite sides to respective carriers by respective adhesive elements, the assembly including at least one plastic support sheet; heating the assembly while mechanically compressing the assembly between the carriers, wherein the strength of adhesion of one of said adhesive elements to the respective carrier and/or to the assembly is partially reduced during said heating of the assembly under mechanical compression; and wherein the strength of adhesion of the said adhesive element to the carrier and/or to the assembly is further reducible by further heating the said adhesive element after partially or completely relaxing the pressure at which the assembly is mechanically compressed between the two carriers.

Abstract: A technique comprising: producing an unencapsulated stack of layers defining one or more electronic devices including an organic semiconductor element; and then subjecting the unencapsulated stack of layers to a water removal treatment in a vacuum oven in the presence of an external water adsorbent; wherein the water removal treatment comprises heating the unencapsulated stack of layers in the vacuum oven for a time period longer than a control time period at which a spike in oven pressure attributable to the release of water from the stack of layers would occur with heating under the same treatment conditions but without the water absorbing material.

Abstract: A technique for producing a device for sensing a target species, comprising: providing first end second components, each comprising a support film, wherein at least one of said first and second components comprises at least one working electrode supported on the respective support film, at least one of said first and second components comprises at least one counter electrode supported on the respective support film, at least one of said first and second components defines a containing barrier supported on the respective support film, and at least one of said first and second components comprises an array of spacer structures supported on the respective support film; depositing a volume of liquid electrolyte on said first component; laminating said second component to said first component so as to spread said volume of liquid electrolyte out in a space created by said array of spacer structures within a liquid electrolyte area bounded by said containing barrier; wherein said liquid electrolyte functions to tra

Abstract: A method, comprising: forming a patterned layer of matrix material and/or one or more patterned layers of colour filter material in situ over a support film; forming in situ over said support film a stack of layers defining electrical circuitry via which each of an array of pixel electrodes is independently addressable; wherein forming said stack of layers comprises forming in situ over said patterned layer of matrix material and/or one or more patterned layers of colour filter material at least: a patterned conductor layer defining an array of source conductors and an array of drain conductors; a layer of semiconductor channel material defining semiconductor channels between the source and drain conductors; and another patterned conductor layer defining an array of gate conductors providing gate electrodes in said channel regions.

Abstract: An optoelectronic device comprising a unit, which unit comprises: a plurality of resiliently flexible sheet components bonded together, the resiliently flexible sheet components comprising: (i) a first sheet component comprising at least a stack of layers defining an array of pixel electrodes and electrical circuitry for independently addressing each pixel electrodes via addressing conductors outside the array of pixel electrodes; and (ii) a second sheet component bonded to a top surface of the first sheet component; wherein the device further comprises one or more driver chips bonded to the first sheet component in a location underlying the second component and for electrical contact between said addressing conductors and terminals of said one or more driver chips; and wherein the thickness of material in the unit in the region of the one or more driver chips is substantially the same as the thickness of material in the unit in the region of the array.