Abstract: A heat sink for an electronic apparatus is disclosed, which comprises a base member and a finned member. The base member has a contact surface, which may be planar. The finned member has fins spaced from one another by webs unitary with the flanges. The finned member is secured to the base member so that each web covers an adjacent portion of the contact surface of the base member. A heat-conductive material is interposed between each web and the adjacent portion of the contact surface of the base member. In a preferred embodiment, the finned member has tabs projecting through slots in the base member and bent so as to secure the finned member mechanically to the base member. Moreover, in the preferred embodiment, the finned member has two lateral flanges and the base member has two lateral flanges, each of which is crimped around one of the lateral flanges og the finned member so as further to secure the finned member mechanically to the base member.
Type:
Grant
Filed:
December 17, 1999
Date of Patent:
June 12, 2001
Assignee:
FlexTek Components, Inc.
Inventors:
Julio Gesklin, John H. Kulp, Alan C. Krempels