Abstract: An electronic circuit device that includes a plurality of electrical circuits disposed on a support substrate, such as an electronic display device, includes one or more primary electrodes that extend along a trace on the support substrate, wherein the primary electrodes form one or more primary electrical pathways of or to one or more of the electrical circuits. One or more secondary electrodes are disposed along and in electrical contact with the primary electrodes. The secondary electrodes extend along the trace substantially parallel with the primary electrodes and form secondary electrical pathways adjacent the primary electrical pathways. The secondary electrodes are formed of a secondary conductor that is electrically conductive and has a higher strain limit than the primary electrodes.

Abstract: The present invention relates to new semiconductor materials prepared from perylene-based compounds. Such compounds can exhibit high carrier mobility and/or good current modulation characteristics. In addition, the compounds of the present teachings can possess certain processing advantages such as solution-processability and/or good stability at ambient conditions.

Abstract: An electronic circuit device having a circuit stack, such as an electronic display device with a display stack, includes a protective backing having multiple layers or with a graded layer that protects the electronic circuits from both low velocity impacts and high velocity impacts. The protective backing may have an elastic layer and a viscoelastic layer or have a graded layer with a graded structure that gradually transitions between an elastic region on a first side and a viscoelastic region on a second side. The elastic first layer or region protects the display stack from low velocity impacts while the viscoelastic layer or region protects the display stack from high velocity impacts. The elastic layer or region may be arranged such that it does not add substantial stiffness to the overall circuit stack when it is flexed relatively slowly under normal use.

Abstract: The present teachings relate to new semiconducting compounds including one or more moieties represented by formula (I): wherein X is a chalcogen; and one or more linear conjugated moieties and/or one or more cyclic conjugated moieties other than the moieties represented by formula (I). The present compounds can be used to prepare thin film semiconductor components which can be incorporated into various electronic, optical, and optoelectronic devices.

Abstract: The present teachings relate to polymeric compounds and their use as organic semiconductors in organic and hybrid optical, optoelectronic, and/or electronic devices such as photovoltaic cells, light emitting diodes, light emitting transistors, and field effect transistors. The disclosed compounds generally include as repeating units at least one annulated thienyl-vinylene-thienyl (TVT) unit and at least one other pi-conjugated unit. The annulated TVT unit can be represented by the formula: where Cy1 and Cy2 can be a five- or six-membered carbocyclic ring. The annulated TVT unit can be optionally substituted at any available ring atom(s), and can be covalently linked to the other pi-conjugated unit via either the thiophene rings or the carbocyclic rings Cy1 and Cy2. The other pi-conjugated unit can be a conjugated linear linker including one or more unsaturated bonds, or a conjugated cyclic linker including one or more carbocyclic and/or heterocyclic rings.

Abstract: The present polymeric materials can be patterned with relatively low photo-exposure energies and are thermally stable, mechanically robust, resist water penetration, and show good adhesion to metal oxides, metals, metal alloys, as well as organic materials. In addition, these polymeric materials can be solution-processed (e.g., by spin-coating), and can exhibit good chemical (e.g., solvent and etchant) resistance in the cured form.

Abstract: The present invention relates to new semiconducting compounds having at least one optionally substituted bithiophene sulfonamide moiety. The compounds disclosed herein can exhibit high carrier mobility and/or efficient light absorption/emission characteristics, and can possess certain processing advantages such as solution-processability and/or good stability at ambient conditions.

Abstract: Disclosed herein are new semiconductor materials prepared from dithienylvinylene copolymers with aromatic or heteroaromatic ?-conjugated systems. Such copolymers, with little or no post-deposition heat treatment, can exhibit high charge carrier mobility and/or good current modulation characteristics. In addition, the polymers of the present disclosure can possess certain processing advantages such as improved solution-processability and low annealing temperature.

Abstract: The present invention provides a polymer comprising a unit of formula, wherein R1 and R2 are independently from each other C1-30-alkyl, C2-30-alkenyl, C2-30-alkynyl, phenyl or a 5 to 8 membered heterocyclic ring system, wherein each of the C1-30-alkyl, C2-30-alkenyl or C2-30-alkynyl group may be substituted with 1 to 10 substituents independently selected from the group consisting of halogen, —CN, —NO2, —OH, —NH2, —NH(C1-20-alkyl), —N(C1-20-alkyl)2, —NH—C(O)—(C1-20-alkyl), —S(O)2OH, —CHO, —C(O)—C1-20-alkyl, —C(O)OH, —C(O)—OC1-20-alkyl, —C(O)NH2, —CO(O)NH—C1-20-alkyl, —C(O)N(C1-20-alkyl)2, —O—C1-20-alkyl, —O—C(O)—C1-20-alkyl, —SiH3, SiH2(C1-20-alkyl), SiH(C1-20-alkyl)2, Si(C1-20-alkyl)3, C4-8-cycloalkyl, phenyl and a 5 to 8 membered heterocyclic ring system, and phenyl and the 5 to 8 membered heterocyclic ring system may be substituted with 1 to 5 C1-16-alkyl groups, is 1, 2 or 3 and n is an integer from 2 to 10'000, a process for the preparation of the polymer and an electronic device comprising the p

Abstract: A method for mounting a flexible electronics component to a support structure includes bending the flexible electronics component to be aligned with a curved contour. The curved contour is determined based on a flexibility requirement of a product in which the flexible electronics component is to be integrated and one or more flexibility constraints of the flexible electronics component. The method also includes bending the support structure to be aligned with the curved contour, and adhering the bent flexible electronics component to the bent support structure to produce a flexible electronics assembly.