Abstract: A method comprising molding a first component from a first feedstock comprising a first material powder and a first binder, molding a second component from a second feedstock comprising a second material powder and a second binder, placing the first component and the second component in physical communication with each other in order to form an assembled component, removing the first binder and the second binder from the assembled component and performing a sintering operation on the assembled component so as to bond the first component and the second component together.
Type:
Grant
Filed:
April 29, 2010
Date of Patent:
December 25, 2018
Assignees:
Flextronics Global Services Canada Inc., Services Globaux Flextronics Canada Inc.