Abstract: A device is disclosed including a substrate; an infrared detector coupled to and thermally isolated from the substrate; and a heat shield coupled to the substrate by a plurality of contacts, the heat shield disposed above the infrared detector to block external thermal radiation from being received by the infrared detector. The heat shield is configured to receive a current through the contacts to heat the heat shield to a first temperature, and the infrared detector is configured to detect the first temperature and provide an output signal that is related to a vacuum pressure within the device. Methods for using and forming the device are also disclosed.

Abstract: A gimbal system. The gimbal system may include space-saving features configured to accommodate one or more payload components, thus increasing the payload capacity of the gimbal ball without necessarily increasing the outer dimensions of the gimbal ball. Alternatively, or in addition, the gimbal system may include a motor configured to move at least one gimbal relative to another gimbal about a first axis, with the motor peripherally mounted distal the axis.

Abstract: One or more embodiments of the invention provide a system and method for processing an infrared image to receive infrared image data of a non-uniform scene, apply column noise filter correction to the infrared image data, and/or apply row noise filter correction to the infrared image data, and provide corrected infrared image data based on the column and/or row noise filter correction as infrared output image data.

Abstract: A modular, self-contained optical box is provided. The optical box has a back plate fixedly attached to a front wall. Optical sensors, such as infrared cameras, visible cameras and optical pointers, are fixedly attached to the front wall and the back plate. Distal, round ends of the optical sensors are captured by translation plates. Each translation plate is capable of moving the distal end of the optical element in two directions to or in a planar fashion to align the optical element to the optical box, or to adjust the line of sight of the optical sensors relative to the optical box, before securing the distal end of the optical element. The optical box is designed to be incorporated into a gimbal, and the front wall forms a part of an outer housing of the gimbal. In one embodiment, the optical box is rotatable about one axis relative to the gimbal.

Abstract: Various techniques are provided for implementing a segmented focal plane array (FPA) of infrared sensors. In one example, a system includes a segmented FPA. The segmented FPA includes a top die having an array of infrared sensors (e.g., bolometers). The top die may also include a portion of a read-out integrated circuit (ROIC). The segmented FPA also includes a bottom die having at least a portion of the ROIC. The top and the bottom dies are electrically coupled via inter-die connections. Advantageously, the segmented FPA may be fabricated with a higher yield and a smaller footprint compared with conventional FPA architectures. Moreover, the segmented FPA may be fabricated using different semiconductor processes for each die.

Abstract: An apparatus for the wafer level packaging (WLP) of micro-bolometer vacuum package assemblies (VPAs), in one embodiment, includes a wafer alignment and bonding chamber, a bolometer wafer chuck and a lid wafer chuck disposed within the chamber in vertically facing opposition to each other, means for creating a first ultra-high vacuum (UHV) environment within the chamber, means for heating and cooling the bolometer wafer chuck and the lid wafer chuck independently of each other, means for moving the lid wafer chuck in the vertical direction and relative to the bolometer wafer chuck, means for moving the bolometer wafer chuck translationally in two orthogonal directions in a horizontal plane and rotationally about a vertical axis normal to the horizontal plane, and means for aligning a fiducial on a bolometer wafer held by the bolometer wafer chuck with a fiducial on a lid wafer held by the lid wafer chuck.

Abstract: An imager array may be provided as part of an imaging system. The imager array may include a plurality of sensor arrays (e.g., also referred to as lenslets or optical elements). Each sensor array may include a plurality of sensors (e.g., pixels) associated with a lens. The sensor arrays may be oriented, for example, substantially in a plane facing the same direction and configured to detect images from the same scene (e.g., target area). Such images may be processed in accordance with various techniques to provide images of electromagnetic radiation. The sensor arrays may include filters or lens coatings to selectively detect desired ranges of electromagnetic radiation. Such arrangements of sensor arrays in an imager array may be used to advantageous effect in a variety of different applications.

Abstract: Techniques are disclosed for systems and methods using small form factor infrared imaging modules to monitor aspects of a power system. A system may include one or more infrared imaging modules, a processor, a memory, a display, a communication module, and modules to control components of a power system. Infrared imaging modules may be mounted on, installed in, or otherwise integrated with a power system having one or more power system components. The infrared imaging modules may be configured to capture thermal images of portions of the power system. Various thermal image analytics and profiling may be performed on the captured thermal images to determine the operating conditions and temperatures of portions of the power system. Monitoring information may be generated based on the determined conditions and temperatures and then presented to a user of the power system.

Abstract: Systems and methods disclosed herein provide for some embodiments infrared camera systems for maritime applications. For example in one embodiment, a watercraft includes a plurality of image capture components coupled to the watercraft to capture infrared images around at least a substantial portion of a perimeter of the watercraft; a memory component adapted to store the captured infrared images; a processing component adapted to process the captured infrared images according to a man overboard mode of operation to provide processed infrared images and determine if a person falls from the watercraft; and a display component adapted to display the processed infrared images.

Abstract: Various techniques are provided for systems and methods to process images to reduce consumption of an available output dynamic range by the sky in images. For example, according to one or more embodiments of the disclosure, a region or area in images that may correspond to the sky may be identified based on the location of the horizon in the images. A distribution of irradiance levels in the identified sky region may be analyzed to determine a dynamic range attributable to the sky region. A transfer function that compresses the dynamic range attributable to the sky region may be generated and applied so that the sky in the images may be suppressed, thereby advantageously preserving more dynamic range for terrestrial objects and other objects of interest in the images.

Abstract: An infrared camera system is provided to detect absorption of infrared radiation in a selected spectral bandwidth. In one example, an infrared camera system includes a lens adapted to receive infrared radiation from a survey scene comprising one or more gasses. The infrared camera system also includes a focal plane array comprising a plurality of quantum well infrared photo detectors (QWIPs). The QWIPs are tuned to detect a limited spectral bandwidth of the infrared radiation corresponding to at least a portion of an infrared absorption band of the one or more gasses. The infrared camera system also includes an optical band pass filter positioned substantially between the lens and the focal plane array. The optical band pass filter is adapted to filter the infrared radiation to a wavelength range substantially corresponding to the limited spectral bandwidth of the QWIPs before the infrared radiation is received by the focal plane array.

Abstract: Systems and methods disclosed herein provide for infrared camera systems and methods for dual sensor applications. For example, in one embodiment, an enhanced vision system comprises an image capture component having a visible light sensor to capture visible light images and an infrared sensor to capture infrared images. The system comprises a first control component adapted to provide a plurality of selectable processing modes to a user, receive a user input corresponding to a user selected processing mode, and generate a control signal indicative of the user selected processing mode, wherein the plurality of selectable processing modes includes a visible light only mode, infrared only mode, and a combined visible-infrared mode.

Abstract: Embodiments of the invention describe an illuminator having a light source to originate an illumination beam, wherein the light source further comprises a set of vertical-cavity surface emitting lasers (VCSELs), including a first VCSEL having a first laser emission wavelength, and a second VCSEL having a second laser emission wavelength different than the first laser emission wavelength. Thus, by varying laser emission wavelengths of VCSELs in a VCSEL array, embodiments of the invention produce low-contrast speckle, and do not limit the imaging capabilities of the host illumination system. In some embodiments of the invention, vertical external cavity surface emitting lasers (VECSELs) are utilized to produce the above described varying laser emission wavelengths.

Abstract: A technique of approximating exponential transformations such as gamma correction is disclosed that achieves high resolution without requiring relatively large RAMs for lookup tables or specialized DSP processors. The technique includes the acts of scaling the pixel values according to their values, wherein smaller pixel values are scaled with larger scale factors and larger pixel values are scaled with smaller scale factors; quantizing the scaled pixel values; looking up the quantized pixel values in a lookup table to provide lookup values; and scaling the lookup values responsive to their scale factors to provide the gamma-corrected pixel values.

Abstract: An infrared camera architecture includes, for an embodiment, an infrared detector, a substrate, a plurality of electrical components coupled to the substrate, and a pedestal made of a thermally conductive material and having a leg coupled to the substrate. The infrared detector is supported by and thermally coupled to the pedestal, with the pedestal thermally isolating the infrared detector from the plurality of electrical components.

Abstract: A system is provided that includes: a sensor device adapted to selectively monitor a plurality of sensors, wherein the sensor device includes a wireless transceiver within the sensor device adapted to transmit measurement information from the selected sensor; and a receiver indicator device adapted to wirelessly receive the measurement information from the sensor device, and provide an indication based on the measurement information to a user operating the receiver indicator device.

Abstract: An imager array may be provided as part of an imaging system. The imager array may include a plurality of infrared imaging modules. Each infrared imaging module may include a plurality of infrared sensors associated with an optical element. The infrared imaging modules may be oriented, for example, substantially in a plane facing the same direction and configured to detect images from the same scene. Such images may be processed in accordance with various techniques to provide images of infrared radiation. The infrared imaging modules may include filters or lens coatings to selectively detect desired ranges of infrared radiation. Such arrangements of infrared imaging modules in an imager array may be used to advantageous effect in a variety of different applications.

Abstract: Various techniques are provided for implementing an infrared imaging system. In one example, a system includes a focal plane array (FPA). The FPA includes an array of infrared sensors adapted to image a scene. The FPA also includes a bias circuit adapted to provide a bias voltage to the infrared sensors. The bias voltage is selected from a range of approximately 0.2 volts to approximately 0.7 volts. The FPA also includes a read out integrated circuit (ROIC) adapted to provide signals from the infrared sensors corresponding to captured image frames. Other implementations are also provided.

Abstract: A moisture meter with non-contact temperature measurement capability having a housing, a moisture-detecting device coupled to or contained at least partially in the housing, and having an output related to measured moisture parameters, a non-contact, optically-based temperature sensing device coupled to the housing, having an output related to sensed temperature, an output display contained in the housing, for displaying measurements to a user, and circuitry contained in the housing for processing both the moisture-detecting device output and the non-contact temperature sensing device output, and transmitting the processed outputs to the output display. The moisture-detecting device can be either one or both of a contact-type moisture-detecting device such as a pad on the rear side of the housing, and a pin-type moisture-detecting device in a hand-held probe, and electrically coupled to the circuitry in the housing through a cord.

Abstract: Systems and methods are directed to contacts for an infrared detector. For example, an infrared imaging device includes a substrate having a first metal layer and an infrared detector array coupled to the substrate via a plurality of contacts. Each contact includes for an embodiment a second metal layer formed on the first metal layer; a third metal layer formed on the second metal layer, wherein the third metal layer at least partially fills an inner portion of the contact; and a first passivation layer formed on the third metal layer.