Patents Assigned to Flurence Bioengineering, Inc.
  • Systems and methods for coupling a metal core PCB to a heat sink
    Patent number: 10935227
    Abstract: Embodiments may utilize a series of exposed fins, which increase the surface area of the heat sink creating additional air flow. As hotter air rises within the system, cooler is drawn into the heatsink. The fins may be exposed on both sides of the longitudinal axis, allowing cooler air to be drawn towards the longitudinal axis above the heatsink and flow upward. This process may cool the fins. Additionally, the spacing between the fins may have to be wide enough to allow for air to freely enter the heatsink.
    Type: Grant
    Filed: January 4, 2019
    Date of Patent: March 2, 2021
    Assignee: Flurence Bioengineering, Inc.
    Inventors: Dung Duong, Randall Johnson, Nicholas Klase