Abstract: Hot-melt adhesives are based on a random copolyetherester formed from aromatic dicarboxylic acids, terephthalic acid and isophthalic acid wherein the molar proportion of terephthalic acid is at least 55% based on the acid content, with a butanediol content between 20 and 85 mol % and containing at least 10 mol % triethylene glycol; the remainder of the diol content is preferably diethylene glycol. Copolyetheresters of this type are distinguished by excellent adhesion properties, a low melting point, rapid crystallization, and good resistance to laundering and dry cleaning at a minimum viscosity of 80 Pas.