Abstract: A polishing pad is provided herein, which may include a plurality of soluble fibers having a diameter in the range of about 5 to 80 micrometers, and an insoluble component. The pad may also pad include a first surface having a plurality of micro-grooves, wherein the soluble fibers form the micro-grooves in the pad. The micro-grooves may have a width and/or depth up to about 150 micrometers. In addition, a method of forming the polishing pad and a method of polishing a surface with the polishing pad is disclosed.
Type:
Grant
Filed:
March 16, 2012
Date of Patent:
December 2, 2014
Assignee:
FNS Tech No., Ltd.
Inventors:
Oscar K. Hsu, Marc C. Jin, David Adam Wells, John Erik Aldeborgh