Abstract: A metallic foil, and a process for producing the same, having a metallic micro-layer electrodeposited on a surface of the foil, wherein the micro-layer comprises two co-deposited metals each being a metal other than the metal forming the foil, and does not change the topography of the surface on which it is deposited. The foil may be formed of copper, and the micro-layer may be formed of iron and nickel. When bonded to a polymeric substrate the peel strength of the foil is improved.

Abstract: Copper foil having a matte surface and an opposite shiny surface, the shiny surface having thereon a protective metallic coating comprised of a first protective metallic layer, preferably iron, electrodeposited on the shiny surface and a second metallic layer, preferably zinc, electrodeposited on the first layer, the metallic coating be chemically removable without damage to the copper foil and the second metallic layer being softer than the first metallic layer. The matte surface of the copper foil can be bonded to a dielectric material, and the protective metallic coating can be removed from the shiny surface by etching.