Abstract: A heat-dissipation structure of an LED lamp is disclosed. The LED lamp includes a metal profile, a lampshade attached to the metal profile from bottom, a lamp head mounted around the combined lampshade and metal profile, a printed circuit board set in receiving recesses bilaterally formed below the metal profile, and LEDs provided on a surface of the printed circuit board facing the lampshade. The heat-dissipation structure is characterized in a downward-bending accurate profile of the metal profile being formed between the receiving recesses, and two pads being each positioned between the flanges and the printed circuit board, the two pads serving to prop two lateral sides of the printed circuit board upward such that the printed circuit board fits the accurate profile and closely contacts the metal profile with increased contacting area. Thereby, the printed circuit board can have heat accumulated in operation rapidly dissipated from the metal profile.

Abstract: An intelligent energy-saving lamp includes a power source circuit, a main control circuit, a lighting circuit, and an infrared sensor circuit. The outgoing line of the power source circuit is connected to the incoming line of the main control circuit. The outgoing line of the main control circuit is connected to the incoming line of the lighting circuit. The infrared sensor circuit regulates the lighting circuit via the main control circuit. More specifically, the infrared sensor circuit senses the presence or absence of a person in the lighting area and instructs the main control circuit to regulate the lighting circuit accordingly, thereby saving energy. When people leave the lighting area, the lighting circuit enters the energy-saving mode and is prevented from working at maximum power. When people return, however, normal lighting resumes. Power consumption of the lamp in the energy-saving mode is only 20% of that for normal lighting.

Abstract: A heat-dissipation structure of an LED lamp is disclosed. The LED lamp includes a metal profile, a lampshade attached to the metal profile from bottom, a lamp head mounted around the combined lampshade and metal profile, a printed circuit board set in receiving recesses bilaterally formed below the metal profile, and LEDs provided on a surface of the printed circuit board facing the lampshade. The heat-dissipation structure is characterized in a downward-bending accurate profile of the metal profile being formed between the receiving recesses, and two pads being each positioned between the flanges and the printed circuit board, the two pads serving to prop two lateral sides of the printed circuit board upward such that the printed circuit board fits the accurate profile and closely contacts the metal profile with increased contacting area. Thereby, the printed circuit board can have heat accumulated in operation rapidly dissipated from the metal profile.