Abstract: Probe systems for optically probing a device under test (DUT) and methods of operating the probe systems. The probe systems include a probing assembly that includes an optical probe that defines a probe tip and a distance sensor. The probe systems also include a support surface configured to support a substrate, which defines a substrate surface and includes an optical device positioned below the substrate surface. The probe systems further include a positioning assembly configured to selectively regulate a relative orientation between the probing assembly and the DUT. The probe systems also include a controller programmed to control the operation of the probe systems. The methods include methods of operating the probe systems.

Abstract: A skate on a tip of a probe for testing electrical devices is a reduced thickness probe tip contact. Such a skate can advantageously increase contact pressure, but it can also undesirably reduce probe lifetime due to rapid mechanical wear of the skate. Here multilayer skate probes are provided where the overall shape of the probe tip is a smooth curved surface, as opposed to the conventional fin-like skate configuration. The skate layer is the most mechanically wear-resistant layer in the structure, so abrasive processing of the probe tip leads to a probe skate defined by the skate layer. The resulting probes provide the advantage of increased contact pressure without the disadvantage of reduced lifetime.

Abstract: Calibration chucks for optical probe systems, optical probe systems including the calibration chucks, and methods of utilizing the optical probe systems. The calibration chucks include a calibration chuck body that defines a calibration chuck support surface. The calibration chucks also include at least one optical calibration structure that is supported by the calibration chuck body. The at least one optical calibration structure includes a horizontal viewing structure. The horizontal viewing structure is configured to facilitate viewing of a horizontally viewed region from a horizontal viewing direction that is at least substantially parallel to the calibration chuck support surface. The horizontal viewing structure also is configured to facilitate viewing of the horizontally viewed region via an imaging device of the optical probe system that is positioned vertically above the calibration chuck support surface.

Abstract: Probe systems and methods are disclosed herein. The methods include directly measuring a distance between a first manipulated assembly and a second manipulated assembly, contacting first and second probes with first and second contact locations, providing a test signal to an electrical structure, and receiving a resultant signal from the electrical structure. The methods further include characterizing at least one of a probe system and the electrical structure based upon the distance. In one embodiment, the probe systems include a measurement device configured to directly measure a distance between a first manipulated assembly and a second manipulated assembly. In another embodiment, the probe systems include a probe head assembly including a platen, a manipulator operatively attached to the platen, a vector network analyzer (VNA) extender operatively attached to the manipulator, and a probe operatively attached to the VNA extender.

Abstract: Methods of controlling the operation of probe stations and probe stations that perform the methods. The methods including generating a test routine by constructing a substrate map, receiving a test subset input from a user, and updating the substrate map to incorporate information regarding which devices under test (DUTS) of a plurality of DUTs are in a test subset of a plurality of DUTs. The methods also include receiving a pre-test subset input from the user, wherein the pre-test subset is a subset of the test subset, and updating the substrate map to incorporate information which DUTs of the test subset are in the pre-test subset. The methods further include executing the test routine by moving a probe assembly to each DUT in the test subset, selectively performing a pre-test routine on each DUT that is in the pre-test subset, and electrically testing each DUT in the test subset.

Abstract: Probes with fiducial targets, probe systems including the same, and associated methods. The probes include a probe body, a probe beam, a probe tip configured to contact a device under test (DUT), and a fiducial target affixed to the probe beam. The fiducial target is configured to be visible to an optical system to determine a position of the probe tip relative to the DUT. The methods include methods of utilizing and/or manufacturing the probes.

Abstract: Probe systems and methods for calibrating capacitive height sensing measurements. A probe system includes a probe assembly with a probe support body that supports a capacitive displacement sensor that terminates in a sensing tip relative to a substrate and that is configured to generate an uncalibrated capacitive height measurement. A method of utilizing the probe system to generate a calibrated capacitive height measurement includes receiving a height calibration structure architecture; calculating a layer impedance magnitude of each substrate layer of the height calibration structure; and calculating a total layer impedance magnitude of the height calibration structure. The method further includes measuring a measured impedance magnitude and calculating the calibrated capacitive height measurement.

Abstract: Probe systems and methods for collecting an optical image of a device under test (DUT) are disclosed herein. The probe systems include a chuck, a chuck thermal module, an enclosure, an imaging device, and a flow-regulating structure. The chuck defines a support surface configured to support a substrate and the chuck thermal module is configured to regulate a temperature of the chuck. The enclosure defines an enclosed volume, which contains the support surface of the chuck, and an aperture. The imaging device is at least partially external the enclosed volume and the enclosure and the imaging device defines a gap therebetween. The gap at least partially defines a fluid conduit that permits fluid flow between the enclosed volume and an external region. The flow-regulating structure is configured to regulate fluid flow through the fluid conduit. The methods include methods of utilizing the systems.

Abstract: Probe systems for testing a device under test are disclosed herein. The probe systems include a platen that defines an upper surface, an opposed lower surface, and a platen aperture. The probe systems also include a chuck that defines a support surface configured to support a device under test. The probe systems further include a lower enclosure extending from the lower surface of the platen and an upper enclosure extending from the upper surface of the platen. The upper enclosure includes a side wall that defines a side wall aperture, and the side wall and the platen define an intersection angle of at least 30 degrees and at most 60 degrees. The probe systems also include a manipulator, a probe shaft arm, a probe assembly, a test head, and an electrical conductor.

Abstract: Crosstalk between probes in a vertical probe array is reduced by providing a grounded metal carrier disposed between the guide plates of the probe array. The metal carrier includes pockets that are laterally separated from each other by the metal carrier. Probes in different pockets are thereby electrically shielded from each other.

Abstract: Vertical probe heads having a space transformer laterally tiled into several sections are provided. This change relative to conventional approaches improves manufacturing yield. These probe heads can include metal ground planes, and in embodiments where the ground planes are provided as separate metal plates parallel to the guide plates, the metal plates can also be laterally tiled into several sections. Such tiling of metal plates improves manufacturing yield and alleviates thermal mismatch issues. Probes are not mechanically connected to the space transformer, which facilitates replacement of individual probes of an array.

Abstract: Contact engines, probe head assemblies, probe systems, and associated methods for on-wafer testing of the wireless operation of a device under test (DUT). A contact engine includes a flexible dielectric membrane having a first surface and a second surface and a plurality of probes supported by the flexible dielectric membrane. The plurality of probes are oriented to contact a plurality of contact locations on the DUT. Each probe in the plurality of probes includes a corresponding probe tip that projects from the second surface of the flexible dielectric membrane and is configured to electrically and physically contact a corresponding contact location of the plurality of contact locations. The contact engine further includes at least one membrane antenna supported by the flexible dielectric membrane. A probe head assembly includes the contact engine. A probe system includes the probe head assembly. Associated methods include methods of utilizing the contact engine.

Abstract: Improved impedance matching is provided in vertical probe arrays having conductive guide plates by providing ground pins connecting the guide plates that do not mechanically touch the device under test or the input test apparatus. Such ground pins can be disposed in predetermined patterns around corresponding signal probes to improve an impedance match between the probes and the test apparatus and/or the device under test. Preferably all impedances are matched to 50? as is customary for high frequency work.

Abstract: Probe systems and methods are disclosed herein. The methods include directly measuring a distance between a first manipulated assembly and a second manipulated assembly, contacting first and second probes with first and second contact locations, providing a test signal to an electrical structure, and receiving a resultant signal from the electrical structure. The methods further include characterizing at least one of a probe system and the electrical structure based upon the distance. In one embodiment, the probe systems include a measurement device configured to directly measure a distance between a first manipulated assembly and a second manipulated assembly. In another embodiment, the probe systems include a probe head assembly including a platen, a manipulator operatively attached to the platen, a vector network analyzer (VNA) extender operatively attached to the manipulator, and a probe operatively attached to the VNA extender.

Abstract: Probe systems and methods for automatically maintaining alignment between a probe and a device under test (DUT) during a temperature change. The methods include collecting an initial image of a planar offset fiducial and determining an initial height reference of a height offset fiducial. The methods further include changing a temperature of the DUT, automatically maintaining a planar alignment between a probe and the DUT during the changing, and automatically maintaining a height alignment between the probe and the BUT during the changing. The probe systems include a chuck, which defines a support surface configured to support a substrate that includes the DUT, and a probe head assembly, which includes a probe configured to contact a corresponding contact pad of the DUT. The probe systems further include a substrate thermal module, which is configured to regulate a temperature of the DUT, and a controller programmed to execute the methods.

Abstract: Elongated flexible probes can be disposed in holes of upper and lower guide plates of a probe card assembly. Each probe can include one or more spring mechanisms that exert normal forces against sidewalls of holes in one of the guide plates. The normal forces can result in frictional forces against the sidewalls that are substantially parallel to the sidewalls. The frictional forces can reduce or impede movement parallel to the sidewalls of the probes in the holes.

Abstract: Improved wafer-scale testing of optoelectronic devices, such as CMOS image scan devices, is provided. A probe card includes an LED light source corresponding to each device under test in the wafer. The LED light sources provide light from a phosphor illuminated by the LED. A pinhole and lens arrangement is used to collimate the light provided to the devices under test. Uniformity of illumination can be provided by closed loop control of the LED light sources using internal optical signals as feedback signals, in combination with calibration data relating the optical signal values to emitted optical intensity. Uniformity of illumination can be further improved by providing a neutral density filter for each LED light source to improve uniformity from one source to another and/or to improve uniformity of the radiation pattern from each LED light source.

Abstract: Probe systems and methods including electric contact detection. The probe systems include a probe assembly and a chuck. The probe systems also include a translation structure configured to operatively translate the probe assembly and/or the chuck and an instrumentation package configured to detect contact between the probe system and a device under test (DUT) and to test operation of the DUT. The instrumentation package includes a continuity detection circuit, a test circuit, and a translation structure control circuit. The continuity detection circuit is configured to detect electrical continuity between a first probe electrical conductor and a second probe electrical conductor. The test circuit is configured to electrically test the DUT. The translation structure control circuit is configured to control the operation of the translation structure. The methods include monitoring continuity between a first probe and a second probe and controlling the operation of a probe system based upon the monitoring.

Abstract: Shielded probe systems are disclosed herein. The shielded probe systems are configured to test a device under test (DUT) and include an enclosure that defines an enclosure volume, a translation stage with a stage surface, a substrate-supporting assembly extending from the stage surface, an electrically conductive shielding structure, an isolation structure, and a thermal shielding structure. The substrate-supporting assembly includes an electrically conductive support surface, which is configured to support a substrate that includes the DUT. The electrically conductive shielding structure defines a shielded volume. The isolation structure electrically isolates the electrically conductive shielding structure from the enclosure and from the translation stage. The thermal shielding structure extends within the enclosure volume and at least partially between the enclosure and the substrate-supporting assembly.

Abstract: Systems and methods for on-wafer dynamic testing of electronic devices. The systems include a probe head assembly, a probe-side contacting structure, a chuck, and a chuck-side contacting structure. The probe head assembly includes a probe configured to electrically contact a first side of a device under test (DUT). The probe-side contacting structure includes a probe-side contacting region. The chuck includes an electrically conductive support surface configured to support a substrate that includes the DUT and to electrically contact a second side of the DUT. The probe head assembly and the chuck are configured to translate relative to one another to selectively establish electrical contact between the probe and the DUT. The chuck-side contacting structure includes a chuck-side contacting region that is in electrical communication with the electrically conductive support surface and opposed to the probe-side contacting structure. The methods may include methods of operating the system or systems.