Patents Assigned to FORMULATED MATERIALS LLC
  • Patent number: 11746541
    Abstract: The present disclosure describes a sound attenuating flooring system. The sound attenuating flooring system has a subfloor, a sound attenuating material overlaying and contacting only a portion of the subfloor, and an overlayment. The sound attenuating material has a first surface and second surface. The first surface is defined by a plurality of outwardly projecting hollow protrusions. The second surface is defined by a plurality of open recesses corresponding to the plurality of outwardly projecting hollow protrusions. The overlayment overlays the second surface of the sound attenuating material.
    Type: Grant
    Filed: March 31, 2020
    Date of Patent: September 5, 2023
    Assignee: Formulated Materials LLC
    Inventor: John Igo
  • Patent number: 11091915
    Abstract: Disclosed is an embed pan suitable for use with railing embed plates. Railing embed plates are commonly attached by bolts to balcony decks as supports for balcony railings. The disclosed embed pan provides a watertight seal around railing embed plate.
    Type: Grant
    Filed: October 30, 2018
    Date of Patent: August 17, 2021
    Assignee: FORMULATED MATERIALS LLC
    Inventor: John Igo