Abstract: A MEMS structure is provided. The MEMS structure includes a substrate having an opening portion and a backplate disposed on one side of the substrate. The MEMS structure also includes a diaphragm disposed between the substrate and the backplate. The opening portion of the substrate is under the diaphragm, and an air gap is formed between the diaphragm and the backplate. The MEMS structure further includes a pillar structure connected with the backplate and the diaphragm and a protection post structure extending from the backplate into the air gap. From a top view of the backplate, the protection post structure surrounds the pillar structure.

Abstract: A package structure of a micro speaker includes a substrate having a hollow chamber. A diaphragm is disposed on the top surface of the substrate. The diaphragm includes a first portion suspended over the hollow chamber and a second portion surrounding the first portion. In a plan view, the second portion of the diaphragm and the hollow chamber do not overlap. A coil is embedded in the first portion of the diaphragm. At least one dummy structure is embedded in the second portion of the diaphragm, and it is electrically isolated from the coil structure by the diaphragm. A carrier board is disposed on the bottom surface of the substrate. A permanent magnetic element is disposed on the carrier board and in the hollow chamber. A package lid is wrapped around the substrate and the diaphragm, and has a lid opening that exposes a portion of the diaphragm.

Abstract: A MEMS structure is provided. The MEMS structure includes a substrate having an opening portion and a backplate disposed on one side of the substrate and having acoustic holes. The MEMS structure also includes a diaphragm disposed between the substrate and the backplate and extending across the opening portion of the substrate. The diaphragm includes a ventilation hole, and an air gap is formed between the diaphragm and the backplate. The MEMS structure further includes a filler structure disposed on the diaphragm, and a portion of the filler structure is disposed in the ventilation hole.

Abstract: A method for touchless gesture recognition is provided. The method includes transmitting ultrasonic signals via a speaker. The method includes generating ultrasonic signals. The method includes receiving the reflected ultrasonic signals from an object via two or more microphones. The method includes computing a frequency shift according to the reflected ultrasonic signals. The method includes identifying a gesture that corresponds to a movement of the object according to the frequency shift. The method includes performing a function that corresponds to the gesture.

Abstract: A micro-electro-mechanical system (MEMS) microphone is provided. The MEMS microphone includes a substrate, a diaphragm, a backplate and a first protrusion. The substrate has an opening portion. The diaphragm is disposed on one side of the substrate and extends across the opening portion of the substrate. The backplate includes a plurality of acoustic holes. The backplate is disposed on one side of the diaphragm. An air gap is formed between the backplate and the diaphragm. The first protrusion extends from the backplate towards the air gap.

Abstract: A package structure of a micro speaker is provided. The package structure includes a substrate, a diaphragm, a coil, an etch stop layer, a carrier board, a permanent magnetic element, and package lid. The substrate has a hollow chamber. The diaphragm is suspended over the hollow chamber. The coil is embedded in the diaphragm. The etch stop layer is positioned below the coil and overlaps the coil in the direction that is perpendicular to the top surface of the diaphragm. The etch stop layer is made of a metal material. The carrier board is disposed on the bottom surface of the substrate. The permanent magnetic element is disposed on the carrier board and in the hollow chamber. The package lid is wrapped around the substrate and the diaphragm, and has a lid opening that exposes a portion of the top surface of the diaphragm.

Abstract: A package structure of a micro speaker includes a substrate, a diaphragm, a coil, a carrier board, a lid, a first permanent magnetic element, and a second permanent magnetic element. The substrate has a hollow chamber. The diaphragm is suspended over the hollow chamber. The coil is embedded in the diaphragm. The carrier board is disposed on the bottom surface of the substrate. The first permanent magnetic element is disposed on the carrier board and in the hollow chamber. The lid is wrapped around the substrate and the diaphragm. The lid exposes a portion of the top surface of the diaphragm. The second permanent magnetic element is disposed either above the lid or under the lid.

Abstract: A MEMS microphone includes a substrate, a backplate disposed on a side of the substrate, a diaphragm movably disposed between the substrate and the backplate, and a plurality of slots formed on the diaphragm. The slots are spaced apart from each other and have a non-constant width to relieve the residual stress on the diaphragm.

Abstract: A small-array MEMS (micro-electro mechanical system) microphone apparatus is provided. The apparatus includes first and second microphone modules. A first microphone of the first microphone module captures a first acoustic signal from a sound source through a first acoustic hole. A second microphone of the second microphone module captures a second acoustic signal from the sound source through a second acoustic hole. A first integrated circuit performs a first logic operation on the first acoustic signal and the second acoustic signal to generate a first sum acoustic signal. The first integrated circuit performs a sampling delay on the second acoustic signal with a first clock signal, and subtracts the delayed second acoustic signal from the first acoustic signal to obtain a first differential acoustic signal. The first differential acoustic signal has a first directivity. A second integrated circuit bypasses and outputs the second acoustic signal which is omnidirectional.

Abstract: A micro-electro-mechanical system (MEMS) device is provided. The MEMS device includes a substrate, a backplate disposed on a side of the substrate, a diaphragm, and a dynamic valve layer. The substrate forms an opening. The diaphragm is disposed on the side of the substrate and extends across the opening of the substrate, wherein the diaphragm forms a vent hole. The dynamic valve layer is disposed on the side of the substrate and includes a flap portion, wherein the flap portion covers at least a part of the vent hole when viewed in a direction perpendicular to the diaphragm, and the flap portion deforms when air flows through the vent hole.

Abstract: A method for improving voice quality is provided herein. The method includes receiving acoustic signals from a microphone array; receiving sensor signals from an accelerometer sensor of the headset; generating, by a beamformer, a speech output signal and a noise output signal according to the acoustic signals; best-estimating the speech output signal according to the sensor signals to generate a best-estimated signal; and generating a mixed signal according to the speech output signal and the best-estimated signal.

Abstract: A micro-electro-mechanical system (MEMS) microphone is provided. The MEMS microphone includes a substrate, a backplate disposed on a side of the substrate, and a diaphragm movably disposed between the substrate and the backplate. The diaphragm includes a plurality of implantation portions, and the implantation portions have different concentration-depth profiles.

Abstract: A movable embedded microstructure includes a substrate, a diaphragm, a circuit board, a permanent magnetic element, and a multi-layered coil. The substrate has a hollow chamber. The diaphragm is disposed on the substrate, and covers the hollow chamber. The circuit board is bonded to the substrate. The permanent magnetic element is disposed on the circuit board and in the hollow chamber. The multi-layered coil is embedded in the diaphragm.

Abstract: A device for acoustic echo cancellation includes a modulator, a speaker, a microphone, a demodulator, and an adaptive filter. The modulator duplicates a far-end signal to a frequency range that is higher than the far-end signal to be a first frequency-shifted signal and generates a modulated signal according to the far-end signal and the first frequency-shifted signal. The speaker generates a sound signal according to the modulated signal. The microphone generates a microphone signal according to a near-end signal and an echo signal. The echo signal is a convolution of the sound signal with a room impulse response. The demodulator extracts a demodulated signal and an echo-reference signal from the microphone signal. The adaptive filter generates a recovered signal to recover the near-end signal according to the demodulated signal and the echo-reference signal.

Abstract: A MEMS microphone package includes a substrate, a transducer, an integrated circuit chip, and a housing. The substrate has a hollow chamber, a first opening and a second opening, wherein the first opening and the second opening communicate with the hollow chamber. The transducer is disposed on the substrate. The integrated circuit chip is disposed on the substrate. The housing is disposed on the substrate, and covers the integrated circuit chip and the transducer.

Abstract: An electronic device is provided. The electronic device includes a first microphone device, a speaker, a memory circuit, and a processor. The first microphone device is configured to generate first data based on a first sound. The memory circuit at least stores acoustic data. The processor is coupled to the first microphone device and the speaker. The processor generates second data based on the first data and the acoustic data. The speaker generates a second sound based on the second data. The acoustic data includes the frequency-response of human ear and sound-masking data.

Abstract: An electronic device including an earphone device is provided. The earphone device includes a shell, a speaker, a first microphone device, a memory circuit and a controller. The memory circuit stores multiple parameter sets. The first microphone device receives a first sound. The first microphone device generates first data based on the first sound. The controller compares the first data with the parameter sets of the memory circuit and determines which one of the parameter sets corresponds to the first data based on the frequency parameters and the volume parameters. The controller generates second data based on the adjustment parameters of the one of the parameter sets, and the speaker generates a second sound based on the second data. The first sound generates a third sound in the shell, and the phase of the second sound is substantially opposite to the phase of the third sound.

Abstract: A micro-electro-mechanical system (MEMS) microphone is provided. The MEMS microphone includes a substrate, a backplate, a diaphragm, a first insulating protrusion and a plurality of second insulating protrusions. The backplate is disposed on a side of the substrate. The diaphragm is disposed between the substrate and the backplate and is movable relative to the backplate. The first insulating protrusion and the second insulating protrusions are formed on the side of the backplate facing the diaphragm. The first insulating protrusion is connected to and affixed to the diaphragm permanently, and an air gap is formed between the diaphragm and each of the second insulating protrusions.

Abstract: A microphone apparatus is provided. The microphone apparatus includes a microphone cover; a circuit board, an integrated circuit, a first microphone, and a second microphone. The integrated circuit is coupled to the microphone cover and the circuit board to form a first chamber and a second chamber. The first microphone is placed inside the first chamber and configured to capture a first acoustic signal from a sound source. The second microphone is placed inside the second chamber and configured to capture a second acoustic signal from the sound source. The first microphone and the second microphone have the same sensitivity, phase, and omni-directivity. The integrated circuit performs a time-delay process on the second acoustic signal and subtracts the time-delayed second acoustic signal from the first acoustic signal to generate a differential signal. The integrated circuit forms a polar pattern of the microphone apparatus according to the differential signal.

Abstract: A circuit for biasing a transducer including a first plate and a second plate includes a front-end buffer and a charge pump. The front-end buffer generates an internal signal at an internal node in response to a voltage signal of the second plate. The transducer receives the incident sound wave at the first plate to generate the voltage signal at the second plate. The charge pump boosts the internal signal into a boost voltage at the first plate according to a first clock signal.