Patents Assigned to Fox Electronics
  • Integrated circuit package encapsulating a hermetically sealed device
    Patent number: 7327044
    Abstract: An integrated circuit package is disclosed having a semiconductor chip, a device supported by the semiconductor chip, and a molding compound sealing the semiconductor chip and the device together as a composite package. A method of manufacturing the package is also disclosed.
    Type: Grant
    Filed: January 21, 2005
    Date of Patent: February 5, 2008
    Assignee: Fox Electronics
    Inventor: James Bryan Northcutt