Abstract: A heat dissipation device for removing heat from an electronic component mounted on a printed circuit board, includes a heat sink and a clip attaching the heat sink onto the printed circuit board. The heat sink has a rectangular base and a plurality of fins extending upwardly from the base. The fins define a receiving channel therein, which is slantwise to two opposite sides of the heat sink. The clip includes a main body placed in the receiving channel and two latching legs extending obliquely and oppositely from two opposite ends of the main body. The two latching legs are located in front of and in rear of the two opposite sides of the heat sink, respectively, and are parallel thereto.

Abstract: An LED lamp includes a base, a top cover located above the base, a plurality of heat sinks spaced from each other and three LED modules respectively attached to inner sides of the three heat sinks. The heat sinks are sandwiched between base and the top cover and have a plurality of fins extending outwardly from outer sides thereof.

Abstract: A electrical fan includes a frame (10) having a central tube (11), a bearing (30) received in the central tube, a stator (50) mounted around the central tube, and a rotor (70) being rotatably supported by a bearing in the stator. The frame defines an air inlet (19) and an air outlet (17) at two different sides thereof. The stator and the rotor expand radially along a direction from the air inlet to the air outlet. Fan blades (75) extend radially from the rotor. A hub (71) of the rotor has a streamline shaped outer surface. A stator core (511) of the stator is made by powder sintering technology.

Abstract: A heat dissipating apparatus (10) includes a plurality of fins (20) stacked together along a predetermined direction, and a plurality of projection members (23) extending from each fin. Each of the fins includes a main body (22). The main bodies of two adjacent fins define an air passage (29) therebetween. The projection members of a first fin abut against the main body of a second fin, for dividing the air passage into a plurality of small air channels.

Abstract: A heat dissipating device includes a heat sink (60), a radiator (70) and heat-transfer pipes (80). The heat sink includes a chassis (62), a plate (64) separate from the chassis and a plurality of fins (66) extending between the chassis and the plate. The radiator includes a base (72) parallel to the fins. Each heat-transfer pipe includes a heat-absorbing portion (82) thermally positioned to the chassis, a heat-releasing portion (84) thermally positioned to the plate and a heat-transfer portion (86) disposed between the heat-absorbing portion and the heat-releasing portion. The heat-transfer portion is thermally received in the base of the radiator.