Abstract: An electroplating apparatus includes an electroplating tank, a first supporting bar, a first holding element, two second supporting bars, a number of spaced crossbars, a number of second holding elements, and a power supply. The first holding element is suspended in the tank from the first supporting bar, and the first holding element is configured for holding a plate-shaped workpiece in a manner that the workpiece is oriented along the first supporting bar. The second holding elements are suspended from the corresponding crossbars, each of the second holding elements arranged between the first and one of the second supporting bars and configured for holding a metal block. The power supply includes a cathode for electrical connection to the workpiece through the first supporting bar and the first holding element and an anode for electrically connection to the metal blocks through the second supporting bars and the second holding elements.

Abstract: A computer and method obtains user input from an input device to determine applicable installation information of an apparatus according to resource consumption of the apparatus. The computer and method are capable of obtaining resource consumption information of an apparatus according to the installation material from an input device and operable to perform transformation processing to obtain installation data according to resource consumption information of the apparatus. Differences between the installation data and standard specifications are calculated and the specified standard specification corresponding to a difference which is the smallest number in the differences is found. The specified standard specification is outputted.

Abstract: An exemplary apparatus for wet processing a substrate includes a wet processing system and a water supplying system. The wet processing system includes a preliminary rinsing device, a final rinsing device, and a conveyor. The preliminary rinsing device includes a first tank and a first spraying system above the first tank. The final rinsing device includes a second tank and a second spraying system above the second tank. The conveyor is configured for conveying a substrate from the preliminary rinsing device to the final rinsing device. The water supplying system includes a supply pipe configured for supplying water to the second spraying system, a connecting system communicating the second tank and the first spraying system, and a drain pipe communicating with the first tank.

Abstract: A computer obtains user input from an input to control a cutter and a conveyor to cut a substrate. The control module of the computer calculates a total number of cuts of the substrate and a distance that the substrate moves before each cut of the substrate according to user input. A conveyer control module of the computer controls the conveyer to move the substrate, where a reminder signal is sent out after the substrate has moved the distance. A cutter control module of the computer controls the cutter to cut the substrate.

Abstract: A method for manufacturing printed circuit board includes steps below. A first electrically conductive layer including a first surface and a second surface at an opposite side thereof to the first surface is provided. A number of first traces directly formed on the second surface. A first insulating layer is formed on the second surface of the first electrically conductive layer and the surface of the first traces. The electrically conductive layer is etched to form a number of second traces, the second traces superpose the first traces, the first traces and the second traces constitute a circuit pattern.

Abstract: An exemplary mounting support for a flexible printed circuit board is provided. The flexible printed circuit board has a side surface and at least one electronic component mounted on the side surface. The mounting support includes a first surface for contacting with the side surface of the flexible printed circuit board and a second surface on an opposite side of the mounting support to the first surface. The mounting support has at least one first recess defined in the first surface for receiving the at least one electronic component therein and at least one through-hole defined through the first surface and the second surface. The mounting support has at least one second recess defined in the second surface. The mounting support can fix a double surface mounted flexible printed circuit board flatly, thereby enhancing laser processing precision.

Abstract: An exemplary method for manufacturing flexible printed circuit board is provided. A metal foil is supplied from a first feeding roller. The metal foil has a first surface and a second surface on two opposite sides of the metal foil. A first coverlay having a number of first openings defined therein is supplied from a second feeding roller and laminated on the first surface of the metal foil. Electrical traces are formed with the metal foil. A second coverlay having a number of second openings defined therein is supplied from a third feeding roller and laminated on the second surface of the metal foil. Each of the second openings registers with the respective first opening so that the electrical traces are exposed from the corresponding first and second openings. The method can improve quality and efficiency of manufacturing flexible printed circuit boards in a hollowed out form.

Abstract: An electroplating method includes steps of: providing a substrate having a first portion and a second portion connected to the first portion; forming a metallic layer on a surface of the second portion; immersing the first portion of the substrate in an electrolyte solution, applying a current to the metallic layer to electroplate the first portion of the substrate with a metal layer; and moving the substrate in a direction away from the electrolyte solution during electroplating the first portion of the substrate. The method can improve a uniformity of the obtained plating layer.

Abstract: An exemplary electroplating apparatus includes an electroplating tank containing an electroplating solution and including a first side and a second side, a pay out reel arranged adjacent to the first side, a plurality of parallel anode plates in the electroplating solution, a plurality of first conveying rollers in the electroplating solution and adjacent to the first side of the electroplating tank, a plurality of second conveying rollers in the electroplating solution and adjacent to the second side of the electroplating tank, the conveying rollers arranged in a staggered fashion and aligned with the respective anode plates and being electrifiable to allow a current to flow through the flexible substrate, and a take up reel arranged adjacent to the second side. The conveying rollers cooperate to convey the flexible substrate from the pay out reel to the take up reel along a zigzag path.

Abstract: An apparatus for cutting foil strip from a spool includes a holding device, a pulling unit, a cutting unit, a brake unit, a detection unit, and a controller. The supporting is configured for receiving the spool. The pulling unit, the cutting unit, the brake unit are fixed on the holding device. The pulling unit is configured for pulling the foil apart from the spool to the cutting unit. The cutting unit is configured for cutting the foil into pieces. The brake unit is mechanically coupled to the reel and configured for applying a resistance to the spool. The detection unit is mechanically connected with to the reel and configured for sensing the rotation number of the spool. The controller is electronically connected to the sensor and the brake unit and configured for controlling the resistance the brake unit applying to the spool according signal of the detection unit.

Abstract: A printed circuit board includes a composite layer, a first electrically conductive pattern, and a second electrically conductive pattern. The composite layer includes a polymer matrix and an electrically conductive pin embedded therein. The polymer matrix has a first surface and an opposite second surface. The pin includes a catalyst block and a carbon nanotube bundle grown on the catalyst block. The catalyst block is exposed at the first surface, and the carbon nanotube bundle is exposed at the second surface. The first pattern is formed on the first surface, and includes a first electrical contact, which is electrically coupled to the catalyst block. The second pattern is formed on the second surface, and includes a second electrical contact, which is electrically coupled to the carbon nanotube bundle.

Abstract: A flexible base includes a main region configured for forming flexible printed circuit board units; and two conveying regions respectively arranged on two sides of the main region. Each of the conveying regions includes an insulating substrate, a plurality of sprocket holes, and a patterned supporting layer. The sprocket holes are defined along a lengthwise direction of the insulating substrate. The patterned supporting layer is formed on the insulating substrate. The patterned supporting layer extends from an edge of each sprocket hole towards a periphery region of the corresponding sprocket.

Abstract: A method for manufacturing a printed circuit board (PCB) having different thicknesses in different areas includes: providing a first substrate having two lateral unwanted portions bounded two imaginary boundary lines, a binder layer having a through opening and a second substrate having a mounting area for mounting electronic elements; forming two slots bounded the imaginary boundary lines in an intermediated unwanted portion of the first substrate corresponding to the mounting area; laminating the first and second substrates, and the binder layer with the mounting area exposed via the through opening; filling the two slots and the through opening with a filling material, thereby obtaining a semifinished PCB board; cutting the semifinished PCB board along the imaginary boundary lines to remove the two lateral unwanted portions and a portion of the second substrate corresponding to the two lateral unwanted portions; and removing the intermediate unwanted portion and the filling material.

Abstract: A stiffener sheet for flexible printed flexible printed circuit boards, includes alternately laminated polyimide layers and polyamideimide layers, wherein a molecular structure of the polyamideimide is represented by the following formula: wherein Ar and Ar? represents different substituted aromatic groups.

Abstract: The present invention relates to a method of cutting PCB module using a laser. The method includes steps of: providing a coverlay film, the coverlay film including at least one opening defined therein; attaching the coverlay film onto the PCB module such that the through holes of the PCB module are covered by the coverlay film and the laser cutting area thereof is exposed via the at least one opening; applying a laser beam to the exposed laser cutting area of the PCB module to cut the PCB module; and removing the coverlay film. A high positioning precision of the PCB module and better cutting result can be obtained.

Abstract: A holder for holding a flexible printed circuit board includes a main body and at least one securing member. The main body includes a hook portion and a holding member, wherein one of the securing member and the holding member comprises at least one magnet, and the other comprises at least one magnetic portion, at least one magnet or combination thereof such that the securing member capable of being magnetically attached to the holding member.

Abstract: In one embodiment, a holder for holding printed circuit boards includes a base plate with a plurality of holding unit formed thereon. Each of the holding units includes a spring member, a securing member, and a blocking structure. The spring member includes a first end and a second end. The first end is attached to the base plate. The securing member is slideably mounted on the base plate. The securing member includes a connecting end and a securing end. The connecting end is connected with the second end of the spring member. The blocking structure is located on the base plate. The spring member is configured for pressing the securing member to move toward the blocking structure such that a printed circuit board is retainable between the securing end of the securing member and the blocking structure on the base plate. The holder is capable of holding printed circuit boards in batches.

Abstract: In one embodiment, a holder for holding a flexible printed circuit board includes a main body and at least one securing member. The main body includes a hook portion and a holding member, wherein one of the securing member and the holding member comprises at least one magnet, and the other comprises at least one magnetic portion, at least one magnet or combination thereof such that the securing member capable of being magnetically attached to the holding member.

Abstract: The present inventions relates to a method for manufacturing a multilayer FPCB having different number of layers in different areas. The method includes the steps of: providing a binder layer; removing a portion of the binder layer thereby defining an opening in the binder layer; forming a multilayer FPCB which having a first copper clad laminate structure and a second copper clad laminate structure disposed on two opposite sides of the binder layer respectively using the binder layer; cutting the first copper clad laminate structure; cutting the multilayer FPCB in manner that a portion of first copper clad laminate structure that is exposed to the opening is separated from the first copper clad structure thereby obtain a multilayer FPCB having different number of layers in different areas.

Abstract: A method for plating a FPCB base board, comprising the steps of: providing a FPCB base board comprising a sprocket region; and placing an insulation shielding plate spatially opposite to the sprocket region of the FPCB base board to limit a thickness of a plating layer formed on the sprocket region of the FPCB base board.