Patents Assigned to Fraivillig Technologies
  • Circuit fabrication using a particle filled adhesive
    Patent number: 6208031
    Abstract: A circuit assembly includes a substrate layer, a first conductive layer mounted to the substrate layer and a second conductive layer. The first and second conductive layers are adhered by an adhesive layer having non-electrically conductive particles for separating the first and second conductive layers.
    Type: Grant
    Filed: March 12, 1999
    Date of Patent: March 27, 2001
    Assignee: Fraivillig Technologies
    Inventor: James Fraivillig