Abstract: The spacing between laterally closely juxtaposed, parallel, rectilinear rows of wafers filled with a sticky composition is increased by advancing the rows of wafers on a supporting surface in a first direction to entrance portions of guiding passages extending at a second direction angularly diverging from the first direction at a bend. The entrance portions are staggered in the direction of advancement. A rotary disc is associated with the entrance portion of each guiding passage and has an upper portion protruding through a slot in the supporting surface and constituting a guiding face facing the guiding passage, and a shaft is arranged below the supporting surface and rotatably supports the rotary disc. An oiling and/or cleaning device is associated with each rotary disc below the supporting surface for oiling and/or cleaning the guiding face of the rotary disc.

Abstract: In a process of making a rolled wafer cone from a baked flat wafer blank made from a sugar-containing wafer dough, the baked wafer blank is rolled to form a wafer cone in a winding mold while the wafer blank is still in a soft, deformable state after the baking operation. Thereafter the rolled wafer cone is permitted to harden. In order to ensure the production of wafer cones having consistently exactly the same shape, it is proposed that the wafer cone which is unrestrained at least in part is shortened in the winding mold to a predetermined length while the wafer cone is adapted to be plastically deformed. For this purpose the rolled wafer cone disposed in the winding mold is subjected to a plastic deformation only at one end or only at both ends.

Abstract: A spreading head is provided for a wafer sheet coating machine, which comprises a wafer sheet conveyor, which is optionally adapted to be lowered. The spreading head comprises a rotating spreading roller and a sizing device, which cooperates with said spreading roller to control the thickness of a layer of a spreadable composition as it is transferred by said spreading roller. The spreading roller and the sizing device define a lower boundary of a reservoir, which is adapted to hold said spreadable composition and which is laterally defined by platelike elements.

Abstract: In a process in which cover sheets and/or coated wafer sheets are joined to form filled wafer blocks, each coated wafer sheet and, if desired, each cover sheet is moved in a stacking location from a lower position to an overlying upper position, the coated upper surface of each coated wafer sheet is joined to the underside of the cover sheet which is in the upper position and which, if desired, has previously been raised to the upper position, or to the underside of the coated wafer sheet which has previously been raised to the upper position, and each complete wafer block consisting of at least two sheets is moved from said upper position out of said stacking location.

Abstract: Apparatus is provided which is used in combination with a machine for coating wafer sheets and serves to form wafer blocks built up in a downward direction. It is desired for avoiding damage to very large wafer sheets as they are assembled to form wafer blocks by means of helical conveyors, which rotate in mutually opposite senses about parallel axes and which move each wafer sheet into engagement with a stop and raise the wafer sheet from a first level to a second, higher level. This is accomplished in that each helical conveyor is provided with at least two helical wire flights, which extend parallel to each other around the axis of rotation of the conveyor. The helical flights of all helical conveyors define a common imaginary surface and support the wafer sheets on said surface. The novel apparatus as well as the wafer sheet coating machine is used in the industrial production of large wafer blocks, which constitute a starting product for the industrial manufacture of slices of wafer blocks.

Abstract: Apparatus for conditioning wafers, such as wafer sheets, flat wafers, low hollow wafers and the like comprises an insulated conditioning chamber, which is closed except for a feed opening and a discharge opening, a revolving conveyor, which extends in the conditioning chamber adjacent to the feed opening and the discharge opening and is provided with successive compartments for receiving wafers, and air-guiding passages, which extend along the path of the compartments and are connected to an air-conditioning plant, which is preferably disposed outside the conditioning chamber. The clearance between the supporting elements which have been moved or swung toward each other is substantially one to 5 times, preferably 1.1 to two times, the wall thickness of a flat wafer or once to twice the height of a low hollow wafer. At least one of the two supporting elements rises above the received wafer at least with a projecting portion.