Patents Assigned to Freeescale Semiconductor, Inc
  • Patent number: 9779247
    Abstract: A hardware security module (HSM) transitions a first signal from a first state to a second state and transitions a second signal from a first state to a second state when a request to change boot code is received. In response to receipt of a boot request, the HSM, when the first signal is in the first state and the second signal is in the first state: does not execute the hash function; and maintains the second signal in the first state. An actuator control module, in response to the receipt of the boot request: executes the boot code when the second signal is in the first state; and does not execute the boot code when the second signal is in the second state.
    Type: Grant
    Filed: May 29, 2015
    Date of Patent: October 3, 2017
    Assignees: GM Global Technology Operations LLC, Freeescale Semiconductor, Inc.
    Inventors: Michael R. Grimes, Richard Soja
  • Publication number: 20100200995
    Abstract: Molecules of a coupling layer composition in a semiconductor device are bidimensionally polymerized in order to provide enhanced moisture blocking effect, particularly when the coupling layer is formed on a porous layer, such as a porous dielectric layer. The deposition of the coupling layer on the underlying structure and/or the cross-polymerization of the coupling layer composition and/or a final metallization can be photo-activated, especially, but not only, using an ultraviolet light.
    Type: Application
    Filed: July 9, 2007
    Publication date: August 12, 2010
    Applicant: Freeescale Semiconductor, Inc
    Inventors: Philippe Monnoyer, Maria Luisa Calvo-Munoz, Janos Farkas, Sabine Szunerits