Patents Assigned to Freescale Semiconuctor, Inc.
  • Die encapsulation using a porous carrier
    Patent number: 7015075
    Abstract: A process for encapsulating an integrated circuit die (403) using a porous carrier (101). In one example, an adhesive structure (e.g. tape) is applied to a porous carrier. Integrated circuit die is then placed on the adhesive structure. The integrated circuit die is then encapsulated to form an encapsulated structure (505). The carrier is then subjected to a solvent that passes through the carrier to reduce the adhesive strength of the adhesive structure for removal of the carrier from the encapsulated structure.
    Type: Grant
    Filed: February 9, 2004
    Date of Patent: March 21, 2006
    Assignee: Freescale Semiconuctor, Inc.
    Inventors: Owen R. Fay, Craig S. Amrine, Kevin R. Lish