Patents Assigned to Freetron (HK) Co.
  • Patent number: 9982101
    Abstract: This invention discloses a method to fuse silicone and thermoplastic resin, comprising the following steps: Step A: conducting treatment twice on thermoplastic resin lid upon molding in plasma equipment under normal temperature, and opening the inert molecular chain of thermoplastic resin; wherein the power for treating the thermoplastic resin lid ranges 500 to 800 W, the time of treatment ranges from 5 s to 60 s; Step B: applying glue on the place for laying silicone gasket on thermoplastic resin lid, baking in the oven for 15-20 min; Step C: putting the treated thermoplastic resin lid and silicone gasket in step B into the over mold for encapsulation, the time of which is 2-3 min; conducting post vulcanization for 2 h after completing the encapsulation.
    Type: Grant
    Filed: May 4, 2016
    Date of Patent: May 29, 2018
    Assignee: HANGZHOU FREETRON INDUSTRIAL CO., LTD.
    Inventors: Ming Xie, Kaixiang Shu
  • Publication number: 20170114194
    Abstract: This invention discloses a method to fuse silicone and thermoplastic resin, comprising the following steps; Step A: conducting treatment twice on thermoplastic resin lid upon molding in plasma equipment under normal temperature, and opening, the inert molecular chain of thermoplastic resin; wherein the power for treating the thermoplastic resin lid ranges 500 to 800 W, the time of treatment ranges from 5 s to 60 s; Step B: applying glue on the place for laying: silicone gasket on thermoplastic resin lid, baking in the oven for 15-20 min; Step C: putting the treated thermoplastic resin lid and silicone gasket in step B into the over mold for encapsulation, the time of which is 2-3 min; conducting post vulcanization for 2 h after completing the encapsulation.
    Type: Application
    Filed: May 4, 2016
    Publication date: April 27, 2017
    Applicant: HANGZHOU FREETRON INDUSTRIAL CO.,LTD.
    Inventors: MING XIE, KAIXIANG SHU
  • Patent number: D347864
    Type: Grant
    Filed: January 15, 1993
    Date of Patent: June 14, 1994
    Assignee: Freetron (HK) Co.
    Inventor: Du C. Duong