Patents Assigned to Frrescale Semiconductor, Inc.
  • Method for processing multiple semiconductor devices for test
    Patent number: 6905891
    Abstract: A packaged array (10) having a temporary substrate (20) is used to test a plurality of semiconductor devices (14). In one embodiment, the temporary substrate (20) is an adhesive substrate, such as tape. A support structure (18) may lie over the temporary substrate (20) or be within the temporary substrate (20). The plurality of semiconductor devices (14) lie within an array (16, 6, or 8) and may be tested in parallel. One array or a multiple number of arrays may lie on the packaged array (10).
    Type: Grant
    Filed: February 28, 2002
    Date of Patent: June 14, 2005
    Assignee: Frrescale Semiconductor, Inc.
    Inventors: Gary J. Kovar, Patrick B. Cochran, Tim V. Pham