Patents Assigned to Fry's Metals, Inc.
-
Patent number: 8641964Abstract: An alloy suitable for use in a ball grid array or chip scale package comprising from 0.05-1.5 wt. % copper, from 0.1-2 wt. % silver, from 0.005-0.3 wt % nickel, from 0.003-0.3 wt % chromium, from 0-0.1 wt. % phosphorus, from 0-0.1 wt. % germanium, from 0-0.1 wt. % gallium, from 0-0.3 wt. % of one or more rare earth elements, from 0-0.3 wt. % indium, from 0-0.3 wt. % magnesium, from 0-0.3 wt. % calcium, from 0-0.3 wt. % silicon, from 0-0.3 wt. % aluminum, from 0-0.3 wt. % zinc, from 0-2 wt. % bismuth, from 0-1 wt. % antimony, from 0-0.2 wt % manganese, from 0-0.3 wt % cobalt, from 0-0.3 wt % iron, and from 0-0.1 wt % zirconium, and the balance tin, together with unavoidable impurities.Type: GrantFiled: February 25, 2008Date of Patent: February 4, 2014Assignee: Fry's Metals, Inc.Inventors: Brian G. Lewis, Bawa Singh, John Laughlin, Ranjit Pandher
-
Patent number: 8312623Abstract: A device including a heat sensitive substrate and an electrical conductor disposed thereon is provided. In certain examples, the heat sensitive substrate may be configured to degrade at or above a sintering temperature. In other examples, the electrical conductor may be processed, prior to disposal on the heat sensitive substrate, at the sintering temperature on a second substrate that can withstand the sintering temperature. Methods and kits are also disclosed.Type: GrantFiled: March 20, 2008Date of Patent: November 20, 2012Assignee: Fry's Metals, Inc.Inventors: Oscar Khaselev, Nitin Desai, Michael T. Marczi, Bawa Singh
-
Patent number: 8304062Abstract: Certain examples disclosed herein are directed to devices that include a substrate and conductor disposed on the substrate. In some examples, each of the conductor and the substrate may include materials that are mutually insoluble in each other. In other examples, the conductor may further comprise a substantially pure metal. In certain examples, the disposed conductor may be configured to pass adhesion tape test ASTM D3359-02. Methods of forming the conductors are also provided.Type: GrantFiled: July 17, 2008Date of Patent: November 6, 2012Assignee: Fry's Metals, Inc.Inventors: Oscar Khaselev, Nitin Desai, Supriya Deverajen, Michael T. Marczi, Bawa Singh
-
Patent number: 8252417Abstract: Metallic particles for electrokinetic or electrostatic deposition, and a method for making such particles, comprising metallic particle bodies, an organic acid film on the particle bodies, and a charge director adhered to the organic acid film.Type: GrantFiled: August 14, 2008Date of Patent: August 28, 2012Assignee: Fry's Metals, Inc.Inventors: Oscar Khaselev, Brian G. Lewis
-
Patent number: 8191757Abstract: In the manufacture of products such as printed wiring boards or chip scale packaging and ball grid arrays, incorporating one or more elements selected from among Ni, Co, Cr, Mn, Zr, Fe and Si into a lead-free soldering process to reduce joint embrittlement. In varied embodiments this is accomplished by spraying onto a solder sphere or preform surface, by spraying onto a device substrate surface, or by incorporating into the device substrate alloy.Type: GrantFiled: February 25, 2008Date of Patent: June 5, 2012Assignee: Fry's Metals, Inc.Inventors: Brian G. Lewis, Bawa Singh, John Laughlin, Ranjit Pandher
-
Patent number: 7968008Abstract: Particles and particle films are provided. In certain examples, particles produced from a single phase process may be used to provide industrial scale synthesis of particles for use in devices such as printed wiring boards.Type: GrantFiled: August 3, 2006Date of Patent: June 28, 2011Assignee: Fry's Metals, Inc.Inventors: Sachin Parashar, Siuli Sarkar, Oscar Khaselev, Brian G. Lewis, Michael T. Marczi, Bawa Singh, Nitin Desai, Michael Liberatore
-
Patent number: 7749883Abstract: A method for providing metallization upon a semiconductor substrate utilizing a stencil having at least one aperture extending from the contact side to the fill side, the contact side of the stencil being substantially flat and forming a sharp edge with a wall of the at least one aperture, the at least one aperture being tapered such that an area of a cross-section of the at least one aperture at the fill side is larger than an area of the cross-section of the at least one aperture at the contact side. A method of forming a stencil for depositing metallization lines on a semiconductor substrate is also disclosed.Type: GrantFiled: August 29, 2008Date of Patent: July 6, 2010Assignee: Fry's Metals, Inc.Inventors: Thomas Meeus, Hans Korsse, Ravindra M. Bhatkal
-
Patent number: 7678255Abstract: A mask for application to a substrate to facilitate electrokinetic deposition of charged particles onto the substrate, the mask comprising a conducting layer, a dielectric layer, and mask openings. A method for applying a pattern of charged particles to a substrate comprising applying the foregoing the substrate to yield a masked substrate; immersing the masked substrate in a bath containing the charged particles; and establishing an electrical potential between the conducting layer of the mask and a counter-electrode thereby electrokinetically depositing the particles through the mask openings onto areas of the substrate exposed in the mask openings. Products made by this method.Type: GrantFiled: May 18, 2006Date of Patent: March 16, 2010Assignee: Fry's Metals, Inc.Inventors: Oscar Khaselev, Brian G. Lewis, Michael Marczi, Bawa Singh
-
Patent number: 7655304Abstract: A method for preparing particles to retain a charge such that the particles are rendered electrostatically or electrokinetically mobile. The method involves coating the particles with a coating medium which facilitates attachment of a charge director material, and contacting the particles with the coating medium thereon with a charge director medium to impart a positive or negative charge thereto and thereby render the particles electrostatically or electrokinetically mobile. Electrostatically and electrokinetically mobile particles for use in an electrostatic or electrokinetic deposition process. The particles include a coating medium and a charge director on particle bodies.Type: GrantFiled: August 14, 2008Date of Patent: February 2, 2010Assignee: Fry's Metals, Inc.Inventors: Sanyogita Arora, Gerard R. Minogue
-
Patent number: 7585549Abstract: A method for applying particles in a pattern to a substrate, either directly or by use of an intermediate tool, by electrokinetic or electrostatic means by exposing the substrate to particles in a fluid medium to electrokinetically or electrostatically deposit the particles onto the substrate.Type: GrantFiled: July 9, 2004Date of Patent: September 8, 2009Assignee: Fry's Metals, Inc.Inventors: Brian G. Lewis, Bawa Singh, Robert H. Detig, Gerard R. Minogue, Dietmar C. Eberlein, Kenneth Reilly, Michael Marczi
-
Patent number: 7533793Abstract: A solder preform for use to attach an electronic component to a substrate. The preform is for placement by a pick-and-place machine using a vacuum nozzle which picks the preform from a preform holder. Each of the sides of the preform configured to function as a vacuum side pick up surface has an enlarged planar surface area. Methods for forming such solder preforms are also disclosed.Type: GrantFiled: December 15, 2004Date of Patent: May 19, 2009Assignee: Fry's Metals, Inc.Inventors: Paul Godijn, Wim Veldhuizen, Patrick Lusse, Mitchell T. Holtzer, Rob van Ekeren, Martin de Haan
-
Publication number: 20090081823Abstract: A method for providing metallization upon a semiconductor substrate utilizing a stencil having at least one aperture extending from the contact side to the fill side, the contact side of the stencil being substantially flat and forming a sharp edge with a wall of the at least one aperture, the at least one aperture being tapered such that an area of a cross-section of the at least one aperture at the fill side is larger than an area of the cross-section of the at least one aperture at the contact side. A method of forming a stencil for depositing metallization lines on a semiconductor substrate is also disclosed.Type: ApplicationFiled: August 29, 2008Publication date: March 26, 2009Applicant: FRY'S METALS, INC.Inventors: Thomas Meeus, Hans Korsse, Ravindra M. Bhatkal
-
Publication number: 20080299394Abstract: A method for preparing particles to retain a charge such that the particles are rendered electrostatically or electrokinetically mobile. The method involves coating the particles with a coating medium which facilitates attachment of a charge director material, and contacting the particles with the coating medium thereon with a charge director medium to impart a positive or negative charge thereto and thereby render the particles electrostatically or electrokinetically mobile. Electrostatically and electrokinetically mobile particles for use in an electrostatic or electrokinetic deposition process. The particles include a coating medium and a charge director on particle bodies.Type: ApplicationFiled: August 14, 2008Publication date: December 4, 2008Applicant: FRY'S METALS, INC.Inventors: Sanyogita Arora, Gerard R. Minogue
-
Publication number: 20080296540Abstract: Metallic particles for electrokinetic or electrostatic deposition, and a method for making such particles, comprising metallic particle bodies, an organic acid film on the particle bodies, and a charge director adhered to the organic acid film.Type: ApplicationFiled: August 14, 2008Publication date: December 4, 2008Applicant: FRY'S METALS, INC.Inventors: Oscar Khaselev, Brian G. Lewis
-
Patent number: 7413805Abstract: Metallic particles for electrokinetic or electrostatic deposition, and a method for making such particles, comprising metallic particle bodies, an organic acid film on the particle bodies, and a charge director adhered to the organic acid film.Type: GrantFiled: February 25, 2005Date of Patent: August 19, 2008Assignee: Fry's Metals, Inc.Inventors: Oscar Khaselev, Brian G. Lewis
-
Patent number: 7413771Abstract: A method for preparing particles to retain a charge such that the particles are rendered electrostatically or electrokinetically mobile. The method involves coating the particles with a coating medium which facilitates attachment of a charge director material, and contacting the particles with the coating medium thereon with a charge director medium to impart a positive or negative charge thereto and thereby render the particles electrostatically or electrokinetically mobile. Electrostatically and electrokinetically mobile particles for use in an electrostatic or electrokinetic deposition process. The particles include a coating medium and a charge director on particle bodies.Type: GrantFiled: July 9, 2004Date of Patent: August 19, 2008Assignee: Fry's Metals, Inc.Inventors: Sanyogita Arora, Gerard R. Minogue
-
Publication number: 20080160310Abstract: In the manufacture of products such as printed wiring boards or chip scale packaging and ball grid arrays, incorporating one or more elements selected from among Ni, Co, Cr, Mn, Zr, Fe and Si into a lead-free soldering process to reduce joint embrittlement. In varied embodiments this is accomplished by spraying onto a solder sphere or preform surface, by spraying onto a device substrate surface, or by incorporating into the device substrate alloy.Type: ApplicationFiled: February 25, 2008Publication date: July 3, 2008Applicant: FRY'S METALS, INC.Inventors: Brian G. Lewis, Bawa Singh, John Laughlin, Ranjit Pandher
-
Publication number: 20080159903Abstract: An alloy suitable for use in a ball grid array or chip scale package comprising from 0.05-1.5 wt. % copper, from 0.1-2 wt. % silver, from 0.005-0.3 wt % nickel, from 0.003-0.3 wt % chromium, from 0-0.1 wt. % phosphorus, from 0-0.1 wt. % germanium, from 0-0.1 wt. % gallium, from 0-0.3 wt. % of one or more rare earth elements, from 0-0.3 wt. % indium, from 0-0.3 wt. % magnesium, from 0-0.3 wt. % calcium, from 0-0.3 wt. % silicon, from 0-0.3 wt. % aluminium, from 0-0.3 wt. % zinc, from 0-2 wt. % bismuth, from 0-1 wt. % antimony, from 0-0.2 wt % manganese, from 0-0.3 wt % cobalt, from 0-0.3 wt % iron, and from 0-0.1 wt % zirconium, and the balance tin, together with unavoidable impurities.Type: ApplicationFiled: February 25, 2008Publication date: July 3, 2008Applicant: FRY'S METALS, INC.Inventors: Brian G. Lewis, Bawa Singh, John Laughlin, Ranjit Pandher
-
Patent number: RE45175Abstract: In PCB manufacture, the pads and/or through-holes of a bare board are protected prior to mounting of other components by a silver plating process. The silver plate is applied from a plating composition by a replacement process in which silver ions oxidized copper and deposit a layer of silver at the surface. In the aqueous plating composition the silver ions are maintained in solution by the incorporation of a multidentate complexing agent. The compositions may contain a silver tarnish inhibitor and are free of reducing agent capable of reducing silver ions to silver metal, halide ions and substantially free of non-aqueous solvent. Surface mounted components can be soldered direct to the silver coated contact using any commercially available solder. Silver does not deposit onto solder mask, but only onto metal which is less electropositive than silver.Type: GrantFiled: October 18, 2012Date of Patent: October 7, 2014Assignee: Fry's Metals, Inc.Inventors: Andrew McIntosh Soutar, Peter Thomas McGrath
-
Patent number: RE45279Abstract: In PCB manufacture, the pads and/or through-holes of a bare board are protected prior to mounting of other components by a silver plating process. The silver plate is applied from a plating composition by a replacement process in which silver ions oxidized copper and deposit a layer of silver at the surface. In the aqueous plating composition the silver ions are maintained in solution by the incorporation of a multidentate complexing agent. The compositions may contain a silver tarnish inhibitor and are free of reducing agent capable of reducing silver ions to silver metal, halide ions and substantially free of non-aqueous solvent. Surface mounted components can be soldered direct to the silver coated contact using any commercially available solder. Silver does not deposit onto solder mask, but only onto metal which is less electropositive than silver. REEXAMINATION RESULTS The questions raised in reexamination proceedings Nos. 90/012,336 and 90/009,934, filed Jun. 4, 2012 and Aug.Type: GrantFiled: May 14, 2012Date of Patent: December 9, 2014Assignee: Fry's Metals, Inc.Inventors: Andrew McIntosh Soutar, Peter Thomas McGrath