Abstract: A process module which can be integrated with a reduced pressure cluster tool system for semiconductor wafer processing to perform ambient or near ambient pressure reactions without requiring an intermediate buffer chamber.
Type:
Grant
Filed:
January 16, 1996
Date of Patent:
October 13, 1998
Assignee:
FSI Interntional
Inventors:
James J. Baecker, D. Scott Becker, Michael J. Foline, Todd K. Maciej