Abstract: An adhesive sheet according to the present invention comprises a substrate having coated on the surface thereof an adhesive layer consisting of an adhesive and a radiation polymerizable compound, which compound is a urethane acrylate oligomer having a molecular weight of 3,000-10,000, preferably 4,000-8,000. The adhesive sheet is preferably used in subjecting semiconductor wafers to dicing operation and no adhesive sticks to and remains on the back side surface of the wafer chips as picked up.

Abstract: In an adhesive paper for copying prepared by laminating an overlying sheet with a release sheet so that an adhesive layer coated on the bottom surface of said overlying sheet is in contact with the releasing surface of said release sheet, the improvement comprising a radiation-induced polymer layer having a glass transition temperature ranging from 50.degree. to 200.degree. C., applied to at least one edge face of said adhesive paper for copying, said radiation-induced polymer layer being formed by applying a solvent free radiation polymerizable composition to said edge face followed by irradiation curing. The presence of the radiation-induced polymer layer prevents an adhesive from squeezing out. The polymer layer, because of its specific glass transition temperature, will not break and fall off. Thus a copying machine will not be contaminated with squeezed adhesive or broken and fallen polymer layer during copying.

Abstract: A cover tape for sealing chips in chip-holding parts of a carrier tape having said parts provided discontinuously and longitudinally of said carrier tape, which cover tape comprises a base tape, an adhesive layer formed on one surface of said base tape and a non-adhesive coat formed on said adhesive layer along the longitudinal direction of said base tape so that said non-adhesive coat has a width broader than that of the chips and narrower than that of said adhesive layer. When the cover tape is used in combination with the carrier tape, the chip-holding parts are sealed by the cover tape having the non-adhesive coat and in consequence the chips held in the chip-holding parts do not come in contact with the adhesive layer although they might come in contact with the non-adhesive coat. Accordingly, the chips are not stained by the adhesive in the adhesive layer.

Abstract: An adhesive sheet according to the present invention comprises a substrate having coated on the surface thereof an adhesive layer consisting of an adhesive and a radiation polymerizable compound, said compound being a urethane acrylate oligomer having a molecular weight of 3,000-10,000, preferably 4,000-8,000. The adhesive sheet is preferably used in subjecting semiconductor wafers to dicing operation and no adhesive sticks to and remains on the back side surface of the wafer chip as picked up.