Abstract: An LED lamp assembly includes a bracket, a heat sink secured on the bracket, a plurality of LED modules mounted on a bottom of the heat sink, and a transparent envelope correspondingly covering the LED modules. A sealing chamber is cooperatively defined by the heat sink, the bracket and the envelope, and the LED modules are received in the sealing chamber. The LED assembly is further provided with a gas-injecting member for injecting a predetermined gas into the sealing chamber of the LED lamp assembly therethrough.
Type:
Grant
Filed:
May 8, 2009
Date of Patent:
January 31, 2012
Assignees:
Fu Zhun Precision Industry Co., Ltd., Foxconn Technology Co., Ltd.
Abstract: A mounting apparatus (1) includes a locking pin (10) and an operation member (20) attaching to the locking pin. Resilient prongs (13) are formed at a first end of the locking pin. A detent (16) is formed at a periphery of the locking pin. The operation member comprises a compressing portion (21) capable of compressing the prongs radially to a predetermined compressed state when the operation member moves axially in a first direction from the second end to the first end and capable of releasing the prongs when the operation member moves axially in an opposite second direction to allow the prongs to return to their original states, and a catch (24) to engage with the detent to prevent movement of the operation member in the second direction to maintain the prongs at the predetermined compressed state.
Type:
Grant
Filed:
October 26, 2004
Date of Patent:
October 3, 2006
Assignees:
Fu Zhun Precision Industry Co., Ltd., Foxconn Technology Co., Ltd.