Patents Assigned to Fu Zhun Precision Industry (Shenzhen) Co., Ltd.
  • Patent number: 8267159
    Abstract: An exemplary thermal module includes a heat absorbing member, a heat sink, a heat conducting member connecting the heat absorbing member with the heat sink, and centrifugal fan. The heat absorbing member has four fixing portions for fixing the thermal module. The heat sink includes a base and a fin assembly disposed on the base. The centrifugal fan includes a housing defining a lateral air outlet therein and an impeller rotatably received in the housing. The housing engages with the engaging portion and is detachably mounted to the heat absorbing member, with the air outlet facing the fin assembly. One of the fixing portions of heat absorbing member is shaded by the housing. The housing and the engaging portion cooperatively provide a sliding mechanism therebetween to allow the centrifugal blower to be slidable relative to the base after the lateral side of the housing detached from the heat absorbing member.
    Type: Grant
    Filed: April 12, 2010
    Date of Patent: September 18, 2012
    Assignees: Fu Zhun Precision Industry (ShenZhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Jian Yang, Jing Zhang
  • Patent number: 8251132
    Abstract: A heat sink assembly includes a base, a fin group and a heat pipe connecting with the base and the fin group. The fin group includes a plurality of fins. Each of the fins defines a recess at a lower portion thereof. The heat pipe includes an evaporating portion extending through the base and a condensing portion extending through the fin group. The base is interferentially fitted into the recesses of the fins. The base, the fin group and the heat pipe directly and intimately connect with each other. The recess and the base have correspondingly T-shaped profiles. Each fin forms a bended flange defining the recess. The bended flange intimately contacts with the base and the evaporating portion of the heat pipe.
    Type: Grant
    Filed: March 27, 2008
    Date of Patent: August 28, 2012
    Assignees: Fu Zhun Precision Industry (ShenZhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Jun Cao, Shi-Wen Zhou, Chun-Chi Chen
  • Patent number: 8118081
    Abstract: A heat dissipation device (100) includes a fin assembly (10) having a plurality of fins (12). Each fin includes a locking tab (126b) with a connecting end (1268), a free end (1269), a hole (1261) adjacent to the connecting end, a hook (1262) adjacent to the free end, and a tongue (1263) between the hole and the hook. A punched hole (127b) in each fin is adjacent to the locking tab, which extends through the punched hole of an adjacent fin. The hook of the locking tab engages the hole in the locking tab of the adjacent fin, locking them together.
    Type: Grant
    Filed: October 8, 2008
    Date of Patent: February 21, 2012
    Assignees: Fu Zhun Precision Industry (ShenZhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Xin-Xiang Zha, Jer-Haur Kuo
  • Patent number: 8007135
    Abstract: An LED lamp includes a heat sink, a plurality of LED modules and a reflector. The heat sink has a conical wall. The LED modules are attached to an inner surface of the wall. The reflector is engaged in the heat sink. The reflector has an outer surface facing and angled with the LED modules. Light generated by the LED modules is reflected by the outer surface of the reflector to radiate out of the LED lamp.
    Type: Grant
    Filed: March 24, 2009
    Date of Patent: August 30, 2011
    Assignees: Fu Zhun Precision Industry (ShenZhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Qian Xiang, Guang Yu
  • Patent number: 7764503
    Abstract: A securing device includes a securing member defining a securing hole, and a fastener. The fastener includes a spring, and a bolt having a main portion, a bottom fixing portion, and a top head portion. The securing hole includes an inner portion and an outer portion extending horizontally from the inner portion to an outside. A width of the outer portion is smaller than the fixing portion and larger than the main portion. The main portion enters into the inner portion through the outer portion. The fixing portion abuts against a bottom of the securing member. The spring is compressed between a top of the securing member and the head portion. A concave is depressed from the securing member and surrounds the inner portion. A lower portion of the spring is fittingly received in the concave.
    Type: Grant
    Filed: October 21, 2008
    Date of Patent: July 27, 2010
    Assignees: Fu Zhun Precision Industry (ShenZhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventor: Xin-Xiang Zha
  • Patent number: 7757687
    Abstract: A solar air conditioning apparatus includes an inlet assembly (20), an outlet assembly (30), a solar collector assembly (10), connecting assemblies (50) and joining members (40). The solar collector assembly includes a plurality of parallel connected solar collectors (11) disposed between inlet units (22) of the inlet assembly and outlet units (32) of the outlet assembly. The solar collector includes a plurality of series connected solar collecting units (12). The solar collecting unit has a bottom plate (12d), a heat-absorbing plate (12f), a brace plate (12g) and a transparent panel (12a). The bottom plate and the heat-absorbing plate respectively have first and second fastening structures (123, 124) and first and second clasping structures (121, 122) for joining the solar collecting units together. The connecting assemblies series connecting the solar collecting units, the inlet and the outlet assemblies. The joining members parallel connecting the inlet units and the outlet units.
    Type: Grant
    Filed: December 27, 2007
    Date of Patent: July 20, 2010
    Assignees: Fu Zhun Precision Industry (ShenZhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Tay-Jian Liu, Xin-Jian Xiao
  • Patent number: 7680407
    Abstract: An auto focusing camera includes a lens unit (2) including a barrel (20) and a lens (22) received in the barrel, a permanent magnet (3) being fixedly mounted around the barrel of the lens unit and moving with the lens unit when the lens unit undergoes telescopic movement during operation, and a coil seat (6a, 6b) with a coil (5a, 5b) wound thereon arranged at a side of the permanent magnet. An interlocking device (642, 202) is formed on the barrel and the coil seat for guiding the telescopic movement of the lens unit.
    Type: Grant
    Filed: November 17, 2006
    Date of Patent: March 16, 2010
    Assignees: Fu Zhun Precision Industry (ShenZhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Cheng-Fang Hsiao, Bing Zhou, Ching-Hsing Huang, Chien-Long Hong, Jen-Hung Chung
  • Publication number: 20090020262
    Abstract: A clip is capable of engaging with a heat sink for securing a fan to the heat sink. The clip includes a mounting plate, a supporting plate, a spring fastener and a spring positioning plate. The supporting plate extends from the mounting plate. The spring fastener extends from the supporting plate and spaced from the mounting plate for pressing the fan toward the heat sink. The spring positioning plate extends from the mounting plate. The mounting plate is horizontally inserted into the heat sink and the spring positioning plate is V-shaped and resiliently engaged in a V-shaped receiving space of the heat sink, thereby securing the clip to the heat sink.
    Type: Application
    Filed: July 16, 2007
    Publication date: January 22, 2009
    Applicants: FU ZHUN PRECISION INDUSTRY (SHENZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.
    Inventor: Jing Zhang
  • Patent number: 7448437
    Abstract: A heat dissipating device includes a heat sink (10), a heat pipe (20), a heat reservoir (30) thermally connecting with the heat sink through the heat pipe, and a fan (40) generating an airflow through the heat sink. The heat pipe includes an evaporating portion (202) attached to the heat sink and a condensing portion (204) attached to the heat reservoir. The heat reservoir is made of metal containing working medium, such as water, therein. The heat reservoir stores or releases heat based on the amount of heat generated by the CPU to realize a compensation to the increase or decrease of temperature of the CPU, whereby the change rate of the temperature of the CPU from idle to busy condition and vice versa can be more stable.
    Type: Grant
    Filed: June 24, 2005
    Date of Patent: November 11, 2008
    Assignees: Fu Zhun Precision Industry (Shenzhen) Co., Ltd., Foxxconn Technology Co., Ltd.
    Inventor: Li He
  • Patent number: 7407000
    Abstract: A liquid cooling device includes a heat-dissipating unit (1) and a heat-absorbing unit (2). The heat-dissipating unit (1) connects with the heat-absorbing unit (2) by an inlet pipe (4) and an outlet pipe (3) to form a closed circulation loop. The heat-dissipating unit (1) includes a base (10), a tank (20), a heat-dissipating body (30) beside the tank (20) and a cover (40), which are assembled together as a single unit. A pump (23) is placed in the tank (20) and operated to pump liquid coolant to flow in the circulation loop. During flowing through the base (10) and the cover (40), the liquid coolant transfers heat to the heat-dissipating body (30).
    Type: Grant
    Filed: August 15, 2005
    Date of Patent: August 5, 2008
    Assignees: Fu Zhun Precision Industry (Shenzhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Hsieh-Kun Lee, Cheng-Tien Lai, Zhi-Yong Zhou, Jiang-Jian Wen
  • Patent number: 7395851
    Abstract: A heat dissipation device comprises a heat spreader for contacting an electronic device for absorbing heat therefrom. A plurality of fins is formed on the heat spreader. A first heat sink is separated from the heat spreader and comprises a first base substantially perpendicular to the heat spreader and a plurality of first fins formed on the first base. A second heat sink comprises a second base connecting with the first base and a plurality of second fins formed on the second base. Two heat pipes connect the heat spreader with the first base and the second base via opposite sides of the heat dissipation device. The heat pipes are partly sandwiched between the first base and the second base and transfers heat from the heat spreader to both of the first and the second heat sink.
    Type: Grant
    Filed: January 30, 2006
    Date of Patent: July 8, 2008
    Assignees: Fu Zhun Precision Industry (Shenzhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Hsieh-Kun Lee, Wan-Lin Xia, Tao Li, Min-Qi Xiao
  • Patent number: 7365978
    Abstract: A heat dissipating device includes a heat sink (60), a radiator (70) and heat-transfer pipes (80). The heat sink includes a chassis (62), a plate (64) separate from the chassis and a plurality of fins (66) extending between the chassis and the plate. The radiator includes a base (72) parallel to the fins. Each heat-transfer pipe includes a heat-absorbing portion (82) thermally positioned to the chassis, a heat-releasing portion (84) thermally positioned to the plate and a heat-transfer portion (86) disposed between the heat-absorbing portion and the heat-releasing portion. The heat-transfer portion is thermally received in the base of the radiator.
    Type: Grant
    Filed: May 23, 2005
    Date of Patent: April 29, 2008
    Assignees: Fu Zhun Precision Industry (Shenzhen) Co., Ltd., Foxcomm Technology Co., Ltd.
    Inventors: Chun-Chi Chen, Shi-Wen Zhou, Meng Fu, Chi Liang
  • Patent number: 7363963
    Abstract: A heat dissipation device for electronic devices on a substrate comprises a base contacting one of the electronic devices for absorbing heat therefrom. A plurality of fins arranged on the base for dissipating heat. A plurality of airflow channels is defined between the fins, and each channel defines an intake and an outlet. A fan is located adjacent to the intakes and provides airflow entering the channels through the intakes and leaving the channels through the outlets. A first guiding member is located adjacent to the outlets. The airflow out of the outlets is guided, by the first guiding member, to be deflected towards the substrate for cooling other electronic devices neighboring the one contacting with the base.
    Type: Grant
    Filed: June 24, 2005
    Date of Patent: April 29, 2008
    Assignees: Fu Zhun Precision Industry (Shenzhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Dong Wang, Tsung-Lung Lee, Li He
  • Patent number: 7363966
    Abstract: A heat dissipating device (1) includes a heat spreader (10), a radiator (2), at least one U-shaped heat pipe (12), a fan (3) mounted on the radiator and a pair of clips (4). The radiator includes a first heat sink (20) and a second heat sink (22). The first heat sink (20) includes a first base (200) and a plurality of fins (202) extending from a side of the first base. The second heat sink (22) includes a second base (220) and a plurality of fins (222) extending from a side of the second base. The heat pipe (12) includes an evaporating portion (120) attached to the heat spreader and a pair of condensing portions (122) extending upwardly from opposite ends of the evaporating portion. The two condensing portions are sandwiched between the first base and the second base. The heat pipe transfers heat from the heat spreader to both of the first base and second base.
    Type: Grant
    Filed: May 23, 2005
    Date of Patent: April 29, 2008
    Assignees: Fu Zhun Precision Industry (Shenzhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Guang Yu, Hsieh-Kun Lee Lee, Cui-Jun Lu
  • Patent number: 7365979
    Abstract: A heat dissipating device (8) includes a heat sink (40), a first and a second fixing members (2, 3) mounted on the heat sink, a lever (1) pivotably mounted to the second fixing member, a fan holder (5) and a fan (6) mounted on the fan holder. A pair of mounting holes (26) is defined in the first fixing member. A catch (38) is bent from the second fixing member for clasping the lever. The fan holder includes a pair of tongues engaged in the mounting holes of the first fixing member, and a U-shaped receiving portion (58) receiving and downwardly pressed by the lever.
    Type: Grant
    Filed: November 1, 2005
    Date of Patent: April 29, 2008
    Assignees: Fu zhun Precision Industry (Shenzhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Hsieh-Kun Lee, Chun-Chi Chen, Shin-Hsuu Wung, Guang Yu, Yong-Dong Chen
  • Patent number: 7365982
    Abstract: A liquid cooling device (10) includes a heat sink (12), a reservoir (14) containing liquid therein and distant from the heat sink, and a heat-transfer member. The heat-transfer member includes a heat-absorbing segment (162) contacting the heat sink and a heat-discharging segment (164) submerged in the liquid of the reservoir.
    Type: Grant
    Filed: November 1, 2005
    Date of Patent: April 29, 2008
    Assignees: Fu Zhun Precision Industry (Shenzhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventor: Li He
  • Patent number: 7353862
    Abstract: A liquid cooling device (10) includes a heat sink (12), a panel (14) distant from the heat sink, a heat transfer member includes a heat exchanger (22) thermally engaging with the heat sink and at least one heat pipe (24), a duct (16) connecting with the panel, a flexible tube (18) connected to the duct and the heat exchanger. Therefore, the panel, the duct, the flexible tube and the heat exchanger cooperatively form a hermetical liquid container filled with liquid therein. The at least one heat pipe is extended in the liquid container and submerged in the liquid to transfer heat from one place near to the heat sink to another place in the panel.
    Type: Grant
    Filed: October 3, 2005
    Date of Patent: April 8, 2008
    Assignees: Fu Zhun Precision Industry (Shenzhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Li He, Tsung-Lung Lee
  • Patent number: 7342795
    Abstract: A heat sink assembly includes a heat spreader (10), a plurality of fins (12) extending from the spreader, fasteners (20) and securement sleeves (30) fixed to the fasteners. The fastener includes a head (200) and a shaft (204) having a threaded bottom end (208). The sleeve comprises a cylindrical wall (302), an upper open end (304) and a lower open end (306). The sleeve further has an annular pedestal (308) perpendicularly connected with the wall and extending in the lower open end. The head is received in the wall and contacts the pedestal. The shaft extends through the spreader. A compressed spring (22) is providing between the head and the spreader for urging the spreader downwardly to engage with a heat generating electronic device.
    Type: Grant
    Filed: October 5, 2005
    Date of Patent: March 11, 2008
    Assignees: Fu zhun Precision Industry (Shenzhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Hsieh-Kun Lee, Chun-Chi Chen, Shi-Wen Zhou, Zhan Wu
  • Patent number: 7342791
    Abstract: A locking device for securing a heat sink to a heat generating electronic device includes a retaining member attached to the heat sink and a plurality of fasteners positioned to the retaining member. The retaining member includes a frame and a plurality of fastening feet integrally formed with the frame by metal extrusion. The frame has an opening for receiving a bottom protrusion of the heat sink therein. Each fastening foot has a slot therein communicating with the opening of the frame and defines a fastening hole. The fasteners are respectively positioned in the fastening holes of the fastening feet of the retaining member.
    Type: Grant
    Filed: August 31, 2005
    Date of Patent: March 11, 2008
    Assignees: Fu Zhun Precision Industry (Shenzhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Hsieh-Kun Lee, Cui-Jun Lu, Ling-Bo Cao
  • Patent number: 7327575
    Abstract: A locking device (10) for securing a heat sink (20) to a heat generating component (30) includes a pair of operating members (14) and a pair of locking members (16). Each operating member includes a pivot shaft (142) defining an axis and an operation handle (144) extending from the pivot shaft along a first direction. The pivot shaft has an offset section (146) offsetting from the axis thereof in a second direction. The first direction and the second direction form an angle therebetween. Each locking member is attached to the offset section of one of the operating members. The operation handle of each operating member is capable of rotating about the axis of the pivot shaft from an unlocked position to a locked position and accordingly the offset section of the pivot shaft drives the locking member to move upwardly.
    Type: Grant
    Filed: February 18, 2005
    Date of Patent: February 5, 2008
    Assignees: Fu Zhun Precision Industry (Shenzhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Fang-Xiang Yu, Shu-Ho Lin, Meng-Tzu Lee