Abstract: A method of inserting and fixing, by means of a machine, lead wires of the electronic components to a printed circuit board having a number of lead-wire-inserting holes, wherein a movable member relative to the printed circuit board is abutted to an electronic component which is already planted (or inserted) in the neighboring space of the targeted lead-wire-inserting holes for the component-to-be-planted, in order to slightly push away the already planted component for clearing or expanding the neighboring space, by means of causing a deformation to the lead wires of the already planted component. This invention includes the provision of apparatuses for realizing the above-mentioned method into practical use.