Patents Assigned to Fuji Polymer Industries Co., Ltd.
  • Patent number: 11926721
    Abstract: Provided is a silicone rubber molded body (1) including a conductive ink coating layer (3) that is disposed on a portion of the surface of the silicone rubber molded body (1). The conductive ink coating layer (3) contains a hydrolyzable organosilicon compound. Using the silicone rubber molded body with a saturated water absorption of 0.10 to 1.50% by mass and/or using a conductive ink containing water improves the affinity between the surface of the silicone rubber molded body (1) and the conductive ink coating layer (3). A residual ink area is an average of 20% or more and 100% or less after the conductive ink coating layer (3) is subjected to an abrasion test. With this configuration, the silicone rubber molded body has a high affinity between the silicone rubber and the conductive ink, good durability under continuous stress, and stability in long-term use. Further provided is a method for producing the silicone rubber molded body.
    Type: Grant
    Filed: January 13, 2022
    Date of Patent: March 12, 2024
    Assignee: Fuji Polymer Industries Co., Ltd.
    Inventors: Tomoki Matsumura, Keisuke Kawahama, Makoto Iwai
  • Patent number: 11781053
    Abstract: A thermally conductive composition includes a matrix resin, a curing catalyst, and thermally conductive particles. The thermally conductive particles include, with respect to 100 parts by mass of the matrix resin component, (a) 900 parts by mass or more of aluminum nitride with an average particle size of 50 ?m or more, (b) 400 parts by mass or more of aluminum nitride with an average particle size of 5 ?m or less, and (c) more than 0 parts by mass and 400 parts by mass or less of alumina with an average particle size of 6 ?m or less. A cured product of the thermally conductive composition has a thermal conductivity of 12 W/m·K or more and an Asker C hardness of 20 to 75. Thus, a thermally conductive composition having a hardness suitable for mounting to an electrical or electronic component and high thermal conductive properties, and a thermally conductive sheet using the thermally conductive composition are provided.
    Type: Grant
    Filed: October 10, 2019
    Date of Patent: October 10, 2023
    Assignee: Fuji Polymer Industries Co., Ltd.
    Inventor: Katsuyuki Suzumura
  • Patent number: 11785752
    Abstract: An electromagnetic wave absorbing thermally conductive composition contains a matrix resin component, metal soft magnetic particles, and thermally conductive particles. The metal soft magnetic particles are carbonyl iron particles and are present in an amount of 30% by volume or more when the electromagnetic wave absorbing thermally conductive composition is a population parameter. A value of an imaginary part (??) of relative permeability of the electromagnetic wave absorbing thermally conductive composition is 0.9 or more in at least some bands in a frequency range of 18 to 26.5 GHz. The electromagnetic wave absorbing thermally conductive composition in the form of a sheet has a thermal conductivity of 2.0 W/m·K or more in the thickness direction. A sheet of the present invention incudes the above composition in the form of a sheet.
    Type: Grant
    Filed: February 19, 2020
    Date of Patent: October 10, 2023
    Assignee: Fuji Polymer Industries Co., Ltd.
    Inventor: Shingo Ito
  • Patent number: 11667825
    Abstract: A thermally conductive sheet contains a matrix resin and thermally conductive particles. The content of the thermally conductive particles is 200 parts by volume or more with respect to 100 parts by volume of the matrix resin component. A polymer viscosity of the matrix resin component after a crosslinking reaction in the absence of the thermally conductive particles is 500 Pa·s or less at 25° C. A thermal conductivity of the thermally conductive sheet is 2.0 W/m·K or more. When the thermally conductive sheet with an initial thickness of 1.5 mm is compressed at a compression rate of 5.0 mm/min to measure a 50% compressive load value, the maximum load value is 100 kPa or more and the load value after 1 minute is more than 0 kPa and 100 kPa or less. With this configuration, the thermally conductive sheet has a high thermal conductivity, a low steady load value, and flexibility.
    Type: Grant
    Filed: October 2, 2019
    Date of Patent: June 6, 2023
    Assignee: Fuji Polymer Industries Co., Ltd.
    Inventor: Hitoshi Shibuya
  • Patent number: 11643554
    Abstract: Composite resin granules 5 contain a binder resin 2 and a thermally conductive filler. The thermally conductive filler includes a non-anisotropic thermally conductive filler 3 and an anisotropic thermally conductive filler 4. The composite resin granules containing the binder resin and the thermally conductive filler are formed into a spherical shape. The particles of the anisotropic thermally conductive filler 4 are oriented in random directions. A thermally conductive rein molded body 6 of the present invention is obtained by compressing the composite resin granules 5. Thus, the present invention provides the thermally conductive resin molded body that has relatively high thermal conductivities in the in-plane direction and the thickness direction, well-balanced directional properties of thermal conduction, and a low specific gravity, the composite resin granules suitable for the thermally conductive resin molded body, and methods for producing them.
    Type: Grant
    Filed: April 30, 2020
    Date of Patent: May 9, 2023
    Assignees: National Institute of Advanced Industrial Science and Technology, Fuji Polymer Industries Co., Ltd.
    Inventors: Yuichi Tominaga, Yoshiki Sugimoto, Yusuke Imai, Yuji Hotta, Setsuo Kikuchi, Makoto Iwai, Takumi Kataishi
  • Patent number: 11450589
    Abstract: A heat conductive sheet of the present invention is a heat conductive sheet containing a curing reaction catalyst, wherein a heat conductive uncured composition 2 not containing a curing reaction catalyst is joined to at least one principal surface of the heat conductive sheet 1 containing a curing reaction catalyst. The heat conductive sheet 1 containing a curing reaction catalyst contains the curing reaction catalyst in an amount necessary to cure the heat conductive uncured composition. A mounting method of the present invention includes: joining a heat conductive uncured composition 2 not containing a curing reaction catalyst to at least one principal surface of the heat conductive sheet 1 containing a curing reaction catalyst, and curing the heat conductive uncured composition by diffusion of the curing reaction catalyst contained in the heat conductive sheet 1.
    Type: Grant
    Filed: April 23, 2019
    Date of Patent: September 20, 2022
    Assignee: Fuji Polymer Industries Co., Ltd.
    Inventors: Setsuo Kikuchi, Takumi Kataishi
  • Patent number: 10994522
    Abstract: A silicone sheet 1 of the present invention is a silicone sheet that is at least one selected from a silicone gel sheet and a silicone putty sheet. The silicone sheet has a Shore 00 hardness of 75 or less. The silicone sheet is cut in a thickness direction and cut faces 5a-5m and 6a-6f of the silicone sheet are adjacent to each other without gap. The cut faces of the silicone sheet are non-tacky, and the silicone sheet is separable at the cut faces. Preferably, the cut faces have a tackiness of 0.6 N or less based on a tackiness checker. The mounting method of the present invention is a method of mounting the above silicone sheet by pick and place mounting using an automatic mounting machine.
    Type: Grant
    Filed: October 2, 2019
    Date of Patent: May 4, 2021
    Assignee: Fuji Polymer Industries Co., Ltd.
    Inventors: Shingo Ito, Yuta Hatazawa
  • Patent number: 10903001
    Abstract: A method and an apparatus for producing a radially aligned magnetorheological elastomer molded body containing a matrix resin and a magnetic filler are provided. The method includes the following: placing a permanent magnet 11 in at least one position selected from positions that are spaced from a metal mold 14a having a cavity 14b and located above and below the center of the metal mold 14a; providing a closed magnetic circuit that allows a magnetic flux 19a generated by the permanent magnet 11 to pass through the metal mold 14a from a side thereof, filling the cavity 14b with a composition containing the matrix resin and the magnetic filler; and molding the composition while the magnetic filler is radially aligned. With this configuration, the elastomer material is molded while the magnetic filler is radially aligned by using the permanent magnet.
    Type: Grant
    Filed: June 12, 2018
    Date of Patent: January 26, 2021
    Assignee: Fuji Polymer Industries Co., Ltd.
    Inventor: Shingo Kobayashi
  • Patent number: 10804004
    Abstract: A conducting film of the present invention includes (A) graphene and/or graphene oxide, and/or derivatives thereof, and (B) a compound having a sulfonic acid group, and/or derivatives thereof, and has a volume resistivity of 1×104 ?·cm or less. A method for producing the conducting film of the present invention includes preparing a dispersion by dispersing a component including (A) graphene and/or graphene oxide, and/or derivatives thereof, and (B) a compound having a sulfonic acid group, and/or derivatives thereof in a dispersion medium, applying the dispersion on a substrate and drying it, and performing heat treatment at a temperature of 100° C. or more. Thereby, the present invention provides a conducting film that has high conductivity and can be applied to a wide range of composites including graphenes, and a method for producing the same.
    Type: Grant
    Filed: July 11, 2016
    Date of Patent: October 13, 2020
    Assignees: NATIONAL UNIVERSITY CORPORATION NAGOYA UNIVERSITY, FUJI POLYMER INDUSTRIES CO., LTD.
    Inventors: Shigeji Konagaya, Toshio Saruyama, Hitoshi Shibuya
  • Patent number: 10662316
    Abstract: A magneto-rheological elastomer composition (10) includes a matrix resin (12) and a magnetic powder (11). The magnetic powder (11) is contained in an amount of 30 to 70% by volume based on 100% by volume of the composition. The magneto-rheological elastomer composition (10) has an Asker C hardness of 5 to 60 as determined by the Standard SRIS0101 of the Society of Rubber Science and Technology, Japan. The average particle size of the magnetic powder is preferably 2 to 500 ?m, and the matrix resin is preferably an organopolysiloxane. The storage modulus of the magneto-rheological elastomer composition preferably changes by five times or more upon application of a magnetic force with a magnetic flux density of 200 mT. Thus, the present invention provides a magneto-rheological elastomer composition that greatly changes its storage modulus upon application of magnetism, a method for producing the same, and a vibration absorbing device including the same.
    Type: Grant
    Filed: December 15, 2016
    Date of Patent: May 26, 2020
    Assignee: Fuji Polymer Industries Co., Ltd.
    Inventors: Shingo Kobayashi, Mai Sugie, Masakazu Hattori, Toshihiko Komatsuzaki
  • Patent number: 10017000
    Abstract: A phosphor-containing identification substance of the present invention includes a substrate and a phosphor-containing silicone thin layer. The whole or part of the surface of the substrate is covered with the phosphor-containing silicone thin layer. The phosphor has identification properties that the phosphor emits light when irradiated with ultraviolet rays or black light, and does not emit light when irradiated with visible rays. A method for producing the phosphor-containing identification substance of the present invention includes bringing a silicone composition for forming a phosphor-containing thin layer into contact with the substrate after or simultaneously with the molding of the substrate, followed by heating. This provides the phosphor-containing identification substance that can be applied to a silicone thin film, has excellent adhesive properties with the substrate, and maintains the inherent properties of the substrate without being impaired by marking, and the method for producing the same.
    Type: Grant
    Filed: March 18, 2015
    Date of Patent: July 10, 2018
    Assignee: Fuji Polymer Industries Co., Ltd.
    Inventors: Toshio Saruyama, Makoto Goto, Takumi Kataishi
  • Patent number: 9862840
    Abstract: A conducting composition of the present invention includes a cellulose nanofiber and a fine particle. The conducting composition includes (A) a cellulose nanofiber, and (B) at least one type of an inorganic powder selected from graphene, graphene oxide, and derivatives thereof. A method for producing the conducting composition includes preparing a dispersion by adding water or a mixed solvent of water and a hydrophilic solvent to (A) a cellulose nanofiber and (B) at least one type of an inorganic powder selected from graphene, graphene oxide, and derivatives thereof, and removing the water or the mixed solvent of water and a hydrophilic solvent from the dispersion. Accordingly, the present invention provides a conducting composition that utilizes a cellulose nanofiber and an inorganic powder having the conductivity at a nano-scale size, can improve the conductivity, and further can have properties such as anisotropy and transparency.
    Type: Grant
    Filed: September 14, 2015
    Date of Patent: January 9, 2018
    Assignees: National University Corporation Nagoya University, Fuji Polymer Industries Co., Ltd.
    Inventors: Shigeji Konagaya, Hitoshi Shibuya, Toshio Saruyama
  • Patent number: 9745498
    Abstract: A heat storage composition (20) of the present invention includes a matrix resin (21) and heat storage inorganic particles (22). The heat storage inorganic particles (22) are composed of a material that undergoes an electronic phase transition and has a latent heat of 1 J/cc or more for the electronic phase transition. The amount of the heat storage inorganic particles is 10 to 2000 parts by weight with respect to 100 parts by weight of the matrix resin. The heat conductivity of the heat storage composition is 0.3 W/m·K or more. The heat storage composition may further include heat conductive particles (23, 24). The heat storage inorganic particles are preferably metal oxide particles containing vanadium as the main metal component. The heat storage composition has high heat storage properties and high heat conduction properties, and is used as a heat storage silicone material provided between a heat generating component and a case.
    Type: Grant
    Filed: October 20, 2014
    Date of Patent: August 29, 2017
    Assignees: Fuji Polymer Industries Co., Ltd., RIKEN
    Inventors: Tomoki Matsumura, Masakazu Hattori, Seiji Niitaka, Kimitoshi Kono
  • Patent number: 9160094
    Abstract: Disclosed is a wire array rubber connector (10), including: an electrical insulating rubber (2); and a plurality of conductive metal wires (1) that are arrayed in a thickness direction of the electrical insulating rubber so as to pass through front and back surfaces of the electrical insulating rubber, and localized so as to be electrically connectable to electrical terminals that are disposed at predetermined positions on the front and back surfaces of the electrical insulating rubber. The electrical insulating rubber (2) is a flame-resistant rubber achieving V-0 based on the UL-94 standard.
    Type: Grant
    Filed: November 15, 2011
    Date of Patent: October 13, 2015
    Assignee: Fuji Polymer Industries Co., Ltd.
    Inventors: Shinji Yamada, Takumi Kataishi, Toshiki Ogawa
  • Patent number: 9053838
    Abstract: A conductive rubber component (10) of the present invention includes a metal coating (2) formed on at least one surface located perpendicular to a compression direction of a conductive rubber single body (1) by atomic and/or molecular deposition, and can be surface mounted and soldered. In a method for mounting a conductive rubber component (10) of the present invention, the conductive rubber component (10) is surface mounted on a wiring layer (8) on a printed wiring board (9) and is fixed by a solder layer (7) thereto and thereby is incorporated to electrically connect the printed circuit board (9) and an electronic component (11) to each other.
    Type: Grant
    Filed: May 18, 2011
    Date of Patent: June 9, 2015
    Assignee: Fuji Polymer Industries Co., Ltd.
    Inventors: Toshiki Ogawa, Masakazu Koizumi
  • Publication number: 20130105198
    Abstract: A conductive rubber component (10) of the present invention includes a metal coating (2) formed on at least one surface located perpendicular to a compression direction of a conductive rubber single body (1) by atomic and/or molecular deposition, and can be surface mounted and soldered. In a method for mounting a conductive rubber component (10) of the present invention, the conductive rubber component (10) is surface mounted on a wiring layer (8) on a printed wiring board (9) and is fixed by a solder layer (7) thereto and thereby is incorporated to electrically connect the printed circuit board (9) and an electronic component (11) to each other.
    Type: Application
    Filed: May 18, 2011
    Publication date: May 2, 2013
    Applicant: FUJI POLYMER INDUSTRIES CO., LTD.
    Inventors: Toshiki Ogawa, Masakazu Koizumi
  • Publication number: 20120322315
    Abstract: Disclosed is a wire array rubber connector (10), including: an electrical insulating rubber (2); and a plurality of conductive metal wires (1) that are arrayed in a thickness direction of the electrical insulating rubber so as to pass through front and back surfaces of the electrical insulating rubber, and localized so as to be electrically connectable to electrical terminals that are disposed at predetermined positions on the front and back surfaces of the electrical insulating rubber. The electrical insulating rubber (2) is a flame-resistant rubber achieving V-0 based on the UL-94 standard.
    Type: Application
    Filed: November 15, 2011
    Publication date: December 20, 2012
    Applicant: FUJI POLYMER INDUSTRIES CO., LTD.
    Inventors: Shinji Yamada, Takumi Kataishi, Toshiki Ogawa
  • Patent number: 8324313
    Abstract: The thermally conductive resin composition of the present invention contains (a) a matrix component, (b) a larger-diameter thermally conductive inorganic powder, (c) a smaller-diameter thermally conductive inorganic powder, and (d) a vulcanizing agent and/or curing agent. The surface of the smaller-diameter thermally conductive inorganic powder is selectively treated with a silane compound represented by R(CH3)aSi(OR?)3-a (wherein R is an unsubstituted or substituted organic group having 6 to 20 carbon atoms, R? is an alkyl group having 1 to 4 carbon atoms, and a is 0 or 1) or a partially hydrolyzed product thereof, and the amount thereof is smaller than the amount necessary to coat the entire surface area of the smaller-diameter thermally conductive inorganic powder.
    Type: Grant
    Filed: April 21, 2009
    Date of Patent: December 4, 2012
    Assignee: Fuji Polymer Industries Co., Ltd.
    Inventor: Hajime Funahashi
  • Patent number: 8273209
    Abstract: A thermal diffusion sheet of the present invention includes a graphite sheet and thermally conductive adhesive layers attached to both principal surfaces of the graphite sheet. The thermally conductive adhesive layer on a first surface is substantially the same in size as the graphite sheet. The thermally conductive adhesive layer on a second surface is relatively larger in size than the thermally conductive adhesive layer on the first surface, and the entire periphery of the thermally conductive adhesive layer on the second surface lies outside the graphite sheet. The adhesive strength of the thermally conductive adhesive layers on the first and second surfaces after exposure to 40° C. for 168 hours is reduced by no more than 20% relative to the initial adhesive strength. A hardened material of a polymer component of the thermally conductive adhesive layers on the first and second surfaces has a thermal conductivity of 0.6 W/m·K or more.
    Type: Grant
    Filed: November 23, 2009
    Date of Patent: September 25, 2012
    Assignee: Fuji Polymer Industries Co., Ltd.
    Inventors: Masakazu Hattori, Yoshihiro Fukui, Hajime Funahashi, Eiichi Natsume
  • Patent number: 8177409
    Abstract: A light guide sheet of the present invention includes a silicone rubber sheet 1 and plural printed mark parts 3a to 3d printed on the front surface of the silicone rubber sheet 1. The silicone rubber sheet 1 has a visible light transmittance of 80 to 99% and is provided at an end face thereof with a light incidence portion 2a allowing light to be incident upon the interior of the silicone rubber sheet 1. The light guide sheet is capable of causing the light incident upon the interior of the silicone rubber sheet 1 from the light incidence portion 2a to be diffused by the printed mark parts 3a to 3d, and pass through the printed mark parts 3a to 3d, thereby guiding the light outside from the printed mark parts 3a to 3d.
    Type: Grant
    Filed: November 15, 2007
    Date of Patent: May 15, 2012
    Assignee: Fuji Polymer Industries Co., Ltd.
    Inventors: Hirotoshi Ohta, Kitaaki Ohmori