Abstract: A three-dimensional semiconductor integrated circuit apparatus which permits ready electrical connection and is resistant to deformation and easy to fabricate and a manufacturing method therefor are provided. A second semiconductor substrate is stacked over a third semiconductor substrate, and a first semiconductor substrate is stacked over the second semiconductor substrate. A second integrated circuit is formed over the surface layer of the second semiconductor substrate, and the integrated circuit side of the second semiconductor substrate is bonded to the integrated circuit side of the first semiconductor substrate, resulting in the electrical connection of the first integrated circuit formed over the surface layer of the first semiconductor substrate and the second integrated circuit.