Abstract: Various embodiments may relate to a recycling constant-temperature ceramic floor integrated system, including a floor tile. A plurality of grooves is formed in a bottom surface of the floor tile. The bottom surface of the floor tile is connected to a base plate. A support assembly is laid between each groove and the base plate. The support assembly includes a heat conducting piece and a locating support mounted in up-and-down lapping mode. A reflecting film is disposed between the heat conducting piece and the locating support. The base plate uses a net-structure plate piece, and buckle grooves and buckle blocks are disposed at the periphery of the base plate.