Abstract: The flatness measuring equipment can highly precisely measure flatness of a surface of a large-sized planar member, e.g., an abrasive plate. In the equipment, an elongated member is provided above and parallel to the surface of the planar member to be measured. A movable member is provided to the elongated member and capable of moving along the elongated member. A distance sensor, which is provided to the movable member, measures distance between the movable member and the surface of the planar member. A laser beam source emits a laser beam, at a fixed level, toward the movable member. A light receiving sensor detects a variation of a level of the movable member with respect of the fixed level of the laser beam.

Abstract: An abrasive machine is capable of solving the liquation of metal ions, and improving abrading accuracy. In the abrasive machine, an abrasive plate has an abrasive face capable of abrading a wafer. A holding section includes: a head member located above the abrasive face; a holding plate provided between the head member and the abrasive face, the holding plate having a holding face capable of holding the wafer; and a bellows fixed between the holding plate and the head member, the bellows allowing the holding plate to move close to and away from and incline with respect to the head member, the bellows forming a pressure chamber. Pressing means presses the wafer onto the abrasive face, with the holding plate, by pressurizing the pressure chamber. The bellows is made by cutting a block of plastic without forming seams.

Abstract: The method and the device of the present invention are capable of uniformly using whole surface of a carrying plate, improving the polishing accuracy of wafers and extending span of life of the carrying plate. The method of adhering a plurality of wafers onto a surface of a carrying plate with predetermined spaces is characterized by regularly shifting wafer adhering positions, at which the wafers are respectively adhered, with respect to a standard position of the carrying plate, in the surface of the carrying plate. The wafer adhering position is regularly shifted when the carrying plate is exchanged or predetermined time elapses.

Abstract: The abrasive system of the present invention is capable of automatically and efficiently feeding and discharging work pieces. In the abrasive system, an upper abrasive plate and a lower abrasive plate pinch the work pieces, which are provided in through-holes of a carrier and abrade both faces of each work piece. A carrier driving mechanism moves the carrier, along a circular orbit, without spinning, together with the work pieces. Stopping means stops the movement of the carrier at a predetermined position. The feeding-and-discharging means includes: an arm robot having a work holding unit, which is provided to a front end and capable of holding and releasing the work piece; and an image processing unit for recognizing shapes and positions of the through-holes of the carrier and the work pieces.

Abstract: The method and the device of the present invention are capable of uniformly using whole surface of a carrying plate, improving the polishing accuracy of wafers and extending span of life of the carrying plate. The method of adhering a plurality of wafers onto a surface of a carrying plate with predetermined spaces is characterized by regularly shifting wafer adhering positions, at which the wafers are respectively adhered, with respect to a standard position of the carrying plate, in the surface of the carrying plate. The wafer adhering position is regularly shifted when the carrying plate is exchanged or predetermined time elapses.

Abstract: The disk edge polishing machine is capable of polishing an inner edge of a center hole of a disk and an outer edge thereof. In the disk edge polishing machine, a sucking member has a cylindrical end section. The sucking member sucks the disk by the cylindrical end section and exposes the inner edge and the outer edge of the disk. The sucking member spins together with the disk. An outer polishing member polishes the outer edge of the disk. An inner polishing member is inserted into the center hole and simultaneously polishes the inner edge of the disk. A first driving mechanism relatively moves the outer polishing member and the sucking member close to and away from the outer edge of the disk along a predetermined course. A second driving mechanism relatively moves the inner polishing member and the sucking member close to and away from the inner edge of the disk along another predetermined course extended from the predetermined course.

Abstract: The polishing machine is capable of preventing fine vibrations of a polishing face of a polishing plate. In the polishing machine, a plate holder is rotatably provided to a base. The polishing plate is mounted on the plate holder, and an upper face of the polishing plate is covered with a polishing cloth as the polishing face. A press unit presses a surface of a work piece onto the polishing face of the polishing plate so as to polish the surface of the work piece like a mirror face. A fluid bearing rotatably supports the plate holder by fluid pressure, at a position between the plate holder and the base, so as to keep the polishing face of the polishing plate flat.

Abstract: The abrasive machine of the present invention is capable of smoothly adjust the pressing force of an upper plate. The abrasive machine includes a plate supporting mechanism, which supports the upper polishing plate and is capable of adjusting a pressing force. The plate supporting mechanism comprises: a base frame; a cylinder unit being provided to an upper part of the base frame, ; a rotary plate being rotatably attached to a lower end of a piston rod of the cylinder unit; a plurality of connecting rods being pierced through the rotary plate, lower ends of the connecting rods being connected to the upper plate so as to rotate the upper plate together with the rotary plate; and a plurality of elastic members being provided between the stopper sections of the connecting rods and the rotary plate, whereby the pressing force of the upper plate is adjusted by adjusting a lifting force of the cylinder unit, which suspends the upper plate.

Abstract: The rotary conveyor of the present invention has a simple structure and is capable of preventing an electric cable and an air tube from twisting and cutting. In the rotary conveyor, a rotating section can rotate in the both directions. A number N (an integer three or more) of movable stations are provided to the rotating section with regular angular separations (an angle &thgr;1). The movable stations respectively machine work pieces. The number N of fixed stations are provided on the base section and located at positions corresponding on the movable stations. The fixed stations respectively machine the work pieces with the movable stations. The rotating section is intermittently turned the angle &thgr;1 a prescribed number (N−1) of times, in one direction, from an initial position of the rotating section, then the rotating section is continuously turned, in the other direction, until reaching the initial position.

Abstract: In the polishing system of the present invention, a adhering unit adheres a wafer on a carrying plate using liquid. A polishing unit polishes the wafer using a polishing plate. A feeding unit conveys the carrying plate from the adhering unit to the polishing unit. A dismounting unit removes the wafer from the carrying plate. A first discharging unit conveys the carrying plate from the polishing unit to the dismounting unit. A cleaning unit cleans the vacant carrying plate. A second discharging unit conveys the carrying plate from the dismounting unit to the cleaning unit. A third discharging unit conveys the carrying plate from the cleaning unit to the adhering unit. The units are formed into a loop lines so that the carrying plate is circulated in the loop line and the wafers are polished therein.

Abstract: A polishing machine of the present invention is capable of uniformly polishing a member to be polished with high flatness, and polishing cloth, which is employed in the polishing machine, is uniformly abraded. In the polishing machine, a polishing plate is capable of rotating. A supporting table rotatably supports the polishing plate. A rotary driving mechanism is mounted on the supporting table, and it rotates the polishing plate. A base supports the supporting table. An orbital driving mechanism moves the supporting table along a circular orbit without spinning about its own axis.

Abstract: An object of the present invention is to provide a polishing machine having a smaller holding section. In the polishing machine of the present invention, a polishing plate polishes a wafer. A holding section has a concave section. A carrying plate, which is provided in the concave section, holds the wafer. A press mechanism for pressing the carrying plate toward the polishing plate comprises an elastic plate dividing an inner space of the concave section into an upper space, which is formed as an air tight chamber, and a lower space, and allowing the carrying plate to move in the vertical and the horizontal directions by elastic transformation, and a fluid supplying unit for supplying fluid into the upper space for pressurizing. In the polishing machine, the elastic plate is formed into a plate, so that its size in the vertical direction can be small, and the vertical size of the polishing machine also can be smaller.

Abstract: The polishing machine of the present invention is capable of moving a work away from a center roller and a guide roller without reference to other members. In the polishing machine, a circular polishing plate is capable of revolving so as to polish works. A center roller is capable of revolving. Guide rollers are arranged around the center roller and capable of revolving, wherein each work is rotatably held between each guide roller and the center roller. An arm shaft is provided in the vicinity of the polishing plate and capable of moving in the longitudinal direction. A work head is provided to the arm shaft and capable of holding and releasing the work. A driving mechanism moves the arm shaft so as to move the work head between a discharge position and a specified position. A releasing mechanism slightly moves the arm shaft in the longitudinal direction so as to slightly move the work away from the center roller and the guide roller.