Patents Assigned to FUJIKURA PRINTED CIRCUITS LTD.
  • METHOD FOR MANUFACTURING WIRING BOARD, AND WIRING BOARD
    Publication number: 20240040708
    Abstract: A method of manufacturing a wiring board includes covering a part of a wiring disposed on a base material for the wiring board by disposing a separation layer on the base material; covering the wiring and the separation layer by disposing a cover lay including a removal portion on the base material; and removing the removal portion of the cover lay laminated on the separation layer and exposing a part of the wiring from the cover lay by peeling the separation layer from the base material.
    Type: Application
    Filed: January 19, 2022
    Publication date: February 1, 2024
    Applicant: FUJIKURA PRINTED CIRCUITS LTD.
    Inventors: Daisuke Arai, Shigeki Otsuka