Patents Assigned to Fujitsu Limited, Inc.
  • Methods for fabricating flexible circuit structures
    Patent number: 6391220
    Abstract: Methods and articles used to fabricate flexible circuit structures are disclosed. The methods include depositing a release layer on substrate, and then forming a conductive laminate on the release layer. After the release layer is formed, the conductive laminate can be easily separated by the substrate to eventually form a flexible circuit structure.
    Type: Grant
    Filed: August 18, 1999
    Date of Patent: May 21, 2002
    Assignee: Fujitsu Limited, Inc.
    Inventors: Lei Zhang, Solomon Beilin, Som S. Swamy, James J. Roman