Patents Assigned to Fujitsu Media Devices Limited
  • Multi-mode surface acoustic wave filter device and duplexer
    Patent number: 7078989
    Abstract: A multi-mode surface acoustic wave filter device includes: a piezoelectric substrate; at least one input IDT (interdigital transducer) and at least one output IDT that are formed on the piezoelectric substrate; reflectors that are formed on the piezoelectric substrate and arranged on the external sides of the input IDT and the output IDT; an input terminal that supplies input signals to the input IDT; and an output terminal that receives output signals from the output IDT. In this multi-mode surface acoustic wave filter, the input terminal and the output terminal extend in the same direction.
    Type: Grant
    Filed: October 14, 2003
    Date of Patent: July 18, 2006
    Assignees: Fujitsu Media Devices Limited, Fujitsu Limited
    Inventors: Shogo Inoue, Jun Tsutsumi, Takashi Matsuda, Masanori Ueda
  • Inertial sensor
    Patent number: 7069789
    Abstract: An inertial sensor such as an acceleration sensor or gyro can have superior impact resistance by regulating displacement of a weight portion in the direction of an upper limit. The sensor includes a sensor portion that has a fixing part, a weight portion the height of which is a predetermined size shorter than that of the fixing part, and a beam portion that links the weight portion and the fixing part; a plate-like first stopper portion that covers the weight portion and is bonded to the fixing part with clearance of a predetermined size from the weight portion; and a flat, plate-like second stopper portion that is connected to the fixing part via a bump of a predetermined height on the side opposite the first stopper portion.
    Type: Grant
    Filed: March 31, 2005
    Date of Patent: July 4, 2006
    Assignees: Fujitsu Media Devices Limited, Fujitsu Limited
    Inventors: Hiroshi Tokunaga, Kenji Nagata, Masaaki Ono, Toshio Hanazawa, Hiroshi Ishikawa
  • Surface acoustic wave filter
    Patent number: 7071796
    Abstract: A surface acoustic wave filter capable of obtaining a low insertion loss and wide bandwidth characteristic is provided. The surface acoustic wave filter includes a piezoelectric substrate; a pair of reflective electrodes formed on the piezoelectric substrate; and a plurality of comb electrodes formed between the pair of reflective electrodes on the piezoelectric substrate, wherein, in regard to the neighboring two comb electrodes among the plurality of comb electrodes, an electrode pitch of one comb electrode is set so that continuously varying phases of surface acoustic waves respectively generated by the two comb electrodes are obtained in a gap opposite to an outermost finger electrode of the other neighboring comb electrode.
    Type: Grant
    Filed: June 9, 2004
    Date of Patent: July 4, 2006
    Assignee: Fujitsu Media Devices Limited
    Inventors: Masanori Ueda, Osamu Kawachi, Motoyuki Tajima, Kenya Hashimoto, Takuya Abe
  • Surface acoustic wave device, filter device and method of producing the surface acoustic wave device
    Patent number: 7067956
    Abstract: A surface acoustic wave device includes a piezoelectric substrate on which resonators having comb-like electrodes are formed; and a silicon substrate that is directly bonded to the piezoelectric substrate and is less expansive than the piezoelectric substrate, a cavity being formed in the silicon substrate and being located below at least one of the resonators.
    Type: Grant
    Filed: September 3, 2003
    Date of Patent: June 27, 2006
    Assignees: Fujitsu Media Devices Limited, Fujitsu Limited
    Inventors: Masahiko Imai, Michio Miura, Takashi Matsuda, Masanori Ueda, Osamu Ikata
  • Duplexer using surface acoustic wave filters
    Patent number: 7053731
    Abstract: A duplexer includes two surface acoustic wave (SAW) filters having different center frequencies, a phase matching circuit that matches phases of the two SAW filters, a package in which the SAW filters and the phase matching circuit are housed, the package having a die-attached layer on which a chip of the SAW filters is facedown mounted, and ground line patterns provided on the die-attached layer and an underlying layer that underlies the die-attached layer, the ground line patterns forming inductances.
    Type: Grant
    Filed: April 19, 2004
    Date of Patent: May 30, 2006
    Assignees: Fujitsu Media Devices, Limited, Fujitsu Limited
    Inventors: Yasuhide Iwamoto, Takashi Matsuda
  • Oscillator having a resonant circuit and a drive circuit
    Patent number: 7053721
    Abstract: An oscillator includes a resonant circuit generating a resonant signal, a drive circuit that feeds back the resonant signal to the resonant circuit, and an output terminal connected to a given node of the resonant circuit, an oscillation signal of the oscillator being output via the output terminal.
    Type: Grant
    Filed: November 21, 2003
    Date of Patent: May 30, 2006
    Assignee: Fujitsu Media Devices Limited
    Inventors: Nobuaki Matsuo, Alejandro Puel
  • Micro-oscillation element
    Patent number: 7038830
    Abstract: A micro-oscillation element includes a frame, a movable functional part, a driving mechanism, a beam extending from the functional part to the driving mechanism, and a torsion connector for connecting the frame and the beam to each other. The connector defines a rotational axis about which the functional part rotates. The rotational axis crosses the longitudinal direction of the beam. The beam is shorter than the functional part in the longitudinal direction of the rotational axis.
    Type: Grant
    Filed: August 26, 2004
    Date of Patent: May 2, 2006
    Assignees: Fujitsu Limited, Fujitsu Media Devices Limited
    Inventors: Osamu Tsuboi, Norinao Kouma, Hisao Okuda, Hiromitsu Soneda, Satoshi Ueda, Ippei Sawaki, Yoshitaka Nakamura
  • Method for manufacturing microstructure
    Patent number: 7033515
    Abstract: A method is for manufacturing a microstructure having a thin-walled portion with use of a material substrate. The material substrate has a laminated structure which includes a first conductor layer 101, a second conductor layer 102, a third conductor layer 103, a first insulating layer 104 interposed between the first conductor layer and the second conductor layer, and a second insulating layer 105 interposed between the second conductor layer and the third conductor layer. The first insulating layer is patterned to have a first masking part for covering a thin-wall forming region of the second conductor layer. The second insulating layer is patterned to have a second masking part for covering the thin-wall forming region of the second conductor layer.
    Type: Grant
    Filed: October 17, 2003
    Date of Patent: April 25, 2006
    Assignees: Fujitsu Limited, Fujitsu Media Devices Limited
    Inventors: Norinao Kouma, Yoshihiro Mizuno, Osamu Tsuboi, Hisao Okuda, Hiromitsu Soneda, Satoshi Ueda, Ippei Sawaki, Yoshitaka Nakamura
  • Duplexer having two surface acoustic wave filters on one substrate
    Patent number: 7030716
    Abstract: A duplexer includes two surface acoustic wave filters that are formed on one substrate, at least one of the two surface acoustic wave filters being a ladder filter. In this duplexer, the positional difference between the centers in the surface acoustic wave propagating direction of each two neighboring comb-like electrodes among comb-like electrodes that form series-arm resonators in the ladder filter is equal to or smaller than a fourth of the length in the propagating direction of the comb-like electrode having the larger number of pairs of electrode fingers of each two neighboring comb-like electrodes.
    Type: Grant
    Filed: April 20, 2004
    Date of Patent: April 18, 2006
    Assignees: Fujitsu Media Devices Limited, Fujitsu Limited
    Inventors: Jun Tsutsumi, Shogo Inoue, Takashi Matsuda, Masanori Ueda
  • Duplexer with a ladder filter and a multimode filter on the same substrate
    Patent number: 7026890
    Abstract: A duplexer includes a ladder filter and a multimode filter that are formed on the same surface of a predetermined substrate. In this duplexer, a first comb-like electrode of the ladder filter and a second comb-like electrode of the multimode filter have the same layer structure with the same film thickness. The first comb-like electrode and the second comb-like electrode are formed with single-layer films mainly containing aluminum. The relationship among the film thickness h of the first comb-like electrode and the second comb-like electrode, the center frequency f1 of the frequency band of the ladder filter, and the center frequency f2 of the frequency band of the multimode filter, is expressed as: 300?h×f1?480 300?h×f2?430.
    Type: Grant
    Filed: April 23, 2004
    Date of Patent: April 11, 2006
    Assignees: Fujitsu Media Devices Limited, Fujitsu Limited
    Inventors: Jun Tsutsumi, Shogo Inoue, Takashi Matsuda, Masanori Ueda
  • Inertial sensor
    Patent number: 7019231
    Abstract: An inertial sensor includes a sensing portion having a weight supported by beams, the weight being a movable portion, and a weight stopper that limits a movable range of the weight, the weight stopper being arranged in a vicinity of the weight with a given clearance and being a part of a substrate for the inertial sensor processed with MEMS techniques.
    Type: Grant
    Filed: March 29, 2005
    Date of Patent: March 28, 2006
    Assignees: Fujitsu Media Devices Limited, Fujitsu Limited
    Inventors: Hiroshi Ishikawa, Yoshitaka Nakamura, Hiroshi Tokunaga, Kenji Nagata
  • Solid electrolytic capacitor and manufacturing method of the same
    Patent number: 7006348
    Abstract: A solid electrolytic capacity has an anode foil 2 having dielectric oxide layer 16 formed on surface thereof, a cathode foil 4 having whiskers 18 that are formed on surface thereof and hold carbide grains 17, a separator paper 6 and solid electrolytic layers 12 formed of a conducting polymer. The anode foil 2 and the cathode foil 4 were rolled together across the separator paper 6. The solid electrolytic layers 12 are formed between the anode foil 2 and the cathode foil 4. Thickness of a layer where the whiskers 18 hold the carbide grains 17 is 1 ?m to 5 ?m.
    Type: Grant
    Filed: September 22, 2005
    Date of Patent: February 28, 2006
    Assignee: Fujitsu Media Devices Limited
    Inventors: Akira Ueda, Katsuharu Yamada, Minoru Funahashi
  • Surface acoustic wave device and method of fabricating the same
    Patent number: 7002282
    Abstract: A surface acoustic wave device includes a surface acoustic wave filter element having a piezoelectric substrate on which comb-like electrodes are formed, and a package having a first cavity in which the surface acoustic wave filter is housed. The package includes a flexible chip mounting base having a first surface on which the surface acoustic wave filter is mounted and having a thickness equal to or less than 100 ?m.
    Type: Grant
    Filed: January 27, 2004
    Date of Patent: February 21, 2006
    Assignee: Fujitsu Media Devices Limited
    Inventor: Naoyuki Mishima
  • Oscillator having voltage dividing circuit
    Patent number: 7002424
    Abstract: An oscillator includes a resonance circuit, and a feedback circuit coupled to the resonance circuit. The resonance circuit includes a main resonance element circuit, and a voltage dividing circuit that divides an output voltage of the main resonance element circuit and applies a divided voltage to the feedback circuit.
    Type: Grant
    Filed: May 12, 2003
    Date of Patent: February 21, 2006
    Assignee: Fujitsu Media Devices Limited
    Inventors: Nobuaki Matsuo, Alejandro Puel
  • Surface acoustic wave device with reflection electrodes having pitches that vary
    Patent number: 7002438
    Abstract: A surface acoustic wave device includes: a substrate; a pair of reflection electrodes that are formed on the substrate; and drive electrodes that are interposed between the reflection electrodes. In this surface acoustic wave device, the pitches in each of the reflection electrodes vary according to a predetermined variation pattern. With this structure, the suppression on spurious signals and the shape factor (the sharpness of the cut-off region of the pass band) can be improved at the same time.
    Type: Grant
    Filed: August 25, 2004
    Date of Patent: February 21, 2006
    Assignee: Fujitsu Media Devices Limited
    Inventors: Osamu Kawachi, Satoshi Orito, Takuya Abe
  • Tunable capacitor and method of fabricating the same
    Patent number: 6992878
    Abstract: A tunable capacitor includes a substrate, a stationary electrode and a movable electrode supported by the substrate, piezoelectric actuators that are supported by the substrate and drive the movable electrode, and a dielectric layer interposed between the stationary electrode and the movable electrode.
    Type: Grant
    Filed: March 21, 2003
    Date of Patent: January 31, 2006
    Assignees: Fujitsu Limited, Fujitsu Media Devices Limited
    Inventors: Takeaki Shimanouchi, Masahiko Imai, Tadashi Nakatani, Tsutomu Miyashita, Yoshio Sato
  • Magnetic head supporting and positioning control mechanism
    Patent number: 6980388
    Abstract: A magnetic head supporting mechanism includes a fixing member, a piezoelectric element supported by the fixing member, and a head supporting member provided on the piezoelectric element, a magnetic head being supported by the head supporting member. An acceleration sensor is formed by the head supporting member and the piezoelectric element so as to be incorporated into the mechanism.
    Type: Grant
    Filed: November 18, 2002
    Date of Patent: December 27, 2005
    Assignees: Fujitsu Media Devices Limited, Fujitsu Limited
    Inventors: Hiroshi Ishikawa, Arata Ejiri, Hiroshi Tanaka, Tsuguto Maruyama, Tsutomu Miyashita, Yoshio Satoh
  • Method for manufacturing micro-structural unit
    Publication number: 20050277217
    Abstract: A method for manufacturing a micro-structural unit is provided. By the method, micro-machining is performed on a material substrate including first through third conductive layers and two insulating layers, one of which is interposed between the first and the second conductive layers, and the other between the second and the third conductive layers. The method includes several etching steps performed on the layers of the material substrate that are different in thickness.
    Type: Application
    Filed: August 22, 2005
    Publication date: December 15, 2005
    Applicants: FUJITSU LIMITED, FUJITSU MEDIA DEVICES LIMITED
    Inventors: Norinao Kouma, Osamu Tsuboi, Hisao Okuda, Hiromitsu Soneda, Mi Xiaoyu, Satoshi Ueda, Ippei Sawaki, Yoshitaka Nakamura
  • Surface acoustic wave ladder filter device having resonators with different electrode pitches and electrostatic capacitances
    Patent number: 6972644
    Abstract: A surface acoustic wave device that has surface acoustic wave resonators connected in a multi-stage ladder arrangement, includes: two or more different pitches of comb-like drive electrodes of parallel-arm resonators (P1˜P3) and two or more different pitches of comb-like drive electrodes of series-arm resonators (S1˜S3); reflection electrodes (12, 14) placed at either side of a comb-like drive electrode having a pitch different from that of said comb-like drive electrode; and two or more different electrostatic capacitances of parallel-arm resonators and two or more different electrostatic capacitances of series-arm resonators.
    Type: Grant
    Filed: August 24, 2004
    Date of Patent: December 6, 2005
    Assignee: Fujitsu Media Devices Limited
    Inventors: Toshio Nishizawa, Tomoka Hattanda
  • Method for manufacturing micro-structural unit
    Patent number: 6969629
    Abstract: A method for manufacturing a micro-structural unit is provided. By the method, micro-machining is performed on a material substrate including first through third conductive layers and two insulating layers, one of which is interposed between the first and the second conductive layers, and the other between the second and the third conductive layers. The method includes several etching steps performed on the layers of the material substrate that are different in thickness.
    Type: Grant
    Filed: March 4, 2004
    Date of Patent: November 29, 2005
    Assignees: Fujitsu Limited, Fujitsu Media Devices Limited
    Inventors: Norinao Kouma, Osamu Tsuboi, Hisao Okuda, Hiromitsu Soneda, Mi Xiaoyu, Satoshi Ueda, Ippei Sawaki, Yoshitaka Nakamura