Abstract: A plasma emitting device includes plasma head configured to generate a plasmarized gas and jet the plasmarized gas so generated from a nozzle thereof, a gas supply device configured to supply a gas to the plasma head while controlling a flow rate of the gas, gas tube connecting the gas supply device with the plasma head to constitute a gas flow path, and pressure detector configured to detect a pressure of the gas supplied from the gas supply device. Pressures of gases which are supplied to the plasma head are detected for use for various purposes, whereby the practical plasma emitting device is made up. Specifically, for example, a head clogging, which is a clog impeding a gas flow in the plasma head, can be determined without difficulty based on the detected pressure.

Abstract: A component mounting machine that performs mounting of components by moving a mounting head attached to slide using linear motor, stator of the linear motor that is forms of magnets arranged side by side is arranged on base, movable element is fixed to a slide so as to pass through the stator, and bracket for holding a portion of wires for supplying power to the linear motor and wire protector is fixed to the movable element. Since the bracket is located at a position close to the axis line of the movable element, the rotational moment acting on the slide due to the deformation resistance of the wires and the wire protector caused by the movement of the slide is reduced, and appropriate movement of the slide is ensured.

Abstract: A substrate work system including an information management device to manage traceability information of configuration items that configure a circuit board product; an imaging device to image an identification code attached to the configuration item; and an imaging control device to read the identification code imaged by the imaging device, and transmit a serial number recorded in the identification code to the information management device.

Abstract: In the component mounting system, when an electronic component having a positioning target is held and mounted onto the upper face of a board, the positioning target is aligned to a predetermined position of the board. The component mounting system detects a positional deviation of the positioning target on the upper face of the electronic component and performs an arrangement operation of arranging a positioning material on the board by correcting the arrangement position in accordance with the detected positional deviation. The component mounting system then performs a mounting operation for mounting the electronic component on the board by aligning the positioning target to the predetermined position of the board on which the positioning material has been arranged.

Abstract: A component mounting device including a component mounting head that mounts a component on a board by using a first raising and lowering device and a second raising and lowering device. The second raising and lowering device causes an engaging member to engage with an engaged member of a suction nozzle, and by further advancing the engaging member causes the suction nozzle to advance against a biasing force of biasing member. Further, a control device is configured to cause the engaging member to move in the advancing direction by using the actuator of the second raising and lowering device and detect an engaging position in a vertical direction at which engaging member engages with engaged member.

Abstract: Electronic component supply device of the present invention includes multiple feeders each having an individual control section configured to operate by use of operation software to control a tape feeding mechanism, a host control section capable of holding update software configured to be replaced with at least part of the operation software, and multiple information transmission sections connected between the host control section and the individual control sections of the multiple feeders so as to transmit information and configured to transmit the update software from the host control section to the individual control sections independently of one another. According to this configuration, the multiple information transmission sections can transmit the update software to the different feeders in parallel in terms of time, whereby the updating time can be shortened significantly compared with a case where update software is transmitted sequentially to multiple feeders.

Abstract: A circuit forming method where a metal ink is ejected to a planned formation position of a first wiring at an upper face of a base material. Then, the metal ink is baked, and first wiring is formed. Further, a planned connection section of the first wiring and a second wiring is unbaked. The metal-ink is ejected over an upper face of the unbaked metal ink and a planned formation position of the second wiring at the upper face of the base material. Since the wettability of the upper face of the unbaked metal ink and the wettability of the upper face of the base material are equal to each other, the ejected metal ink ejected and the unbaked metal ink are not separated from each other, so that it is possible to properly connect the first wiring and the second wiring to each other.

Abstract: A mounting device sets a processing region for super-resolution processing based on an approximate position of a main body portion of a component included in a mark image for use in obtaining a position of a fiducial mark and then performs super-resolution processing. Thus, the processing region for super-resolution processing can be appropriately set and prevented from becoming larger than necessary with respect to the main body portion of the component. Further, the processing region for super-resolution processing is determined using the mark image captured under an imaging condition different from that for the component image for use in super-resolution processing. Thus, the processing region can be appropriately set while the component image is kept under an imaging condition suitable for super-resolution processing. Therefore, the processing region for performing super-resolution processing can be set more appropriately, and the super-resolution processing can be efficiently performed.