Abstract: A thin copper foil for a printed wiring board comprising a copper foil supporter having a surface with a roughness; a parting payer consisting of chrome compound; a thin copper foil layer formed on the parting layer which will be attached to a board as printed wiring. A copper-nickel compound metal layer is interposed between the parting layer and the thin copper foil layer, wherein said copper-nickel compound metal layer is formed to be integral with the thin copper foil layer with a peel strength therebetween such that said copper-nickel compound metal layer will be left on the thin copper layer when the parting layer with the copper foil supporter is peeled off.