Abstract: According to the present invention, it is possible to obtain a copper alloy laminated and shaped object having a high strength and a high electrical conductivity. This invention provides a copper alloy powder for laminating and shaping, wherein the copper alloy powder contains a chromium element an amount of which is equal to or more than 0.40 wt % and equal to or less than 1.5 wt %, a silver element an amount of which is equal to or more than 0.10 wt % and equal to or less than 1.0 wt %, and a balance of pure copper and unavoidable impurities.

Abstract: A surface treated copper foil includes: a copper foil; a finely roughened particle treatment layer of copper on at least one surface of the copper foil, the finely roughened particle treatment layer including fine copper particles having a particle size of 40 to 200 nm; a heat resistance treatment layer containing nickel on the finely roughened particle treatment layer; a rust prevention treatment layer containing at least chromium on the heat resistance treatment layer; and a silane coupling agent treatment layer on the rust prevention treatment layer. An amount of nickel attached in the heat resistance treatment layer is 30 to 60 mg/m2.

Abstract: This invention provides a copper powder to which tin (Sn) is added such that a high-density laminated and shaped product can be obtained by a laminating and shaping method using a fiber laser as a heat source by appropriately reducing the electrical conductivity of copper, so a laminated and shaped product having a high density and a high electrical conductivity can be obtained. That is, this invention provides a copper powder for lamination shaping in which a tin element is added to pure copper. Desirably, the copper powder contains 0.5 wt % or more of the tin element. More desirably, the copper powder contains 5.0 wt % or more of the tin element. When the product has an electrical conductivity sufficient as a copper product, the copper powder desirably contains 6.0 wt % or less of the tin element. Furthermore, no element other than the tin element is desirably added to the copper powder.

Abstract: In this invention, a copper powder to which phosphorus (P) is added is developed such that a high-density laminated and shaped product can be obtained by a laminating and shaping method using a fiber laser as a heat source by appropriately reducing the electrical conductivity of copper, so a laminated and shaped product having a high density and a high electrical conductivity can be obtained. This invention is a copper powder for lamination shaping in which a phosphorus element is added to pure copper. The copper powder desirably contains 0.01 wt % or more of the phosphorus element. The copper powder more desirably contains 0.04 wt % or more of the phosphorus element. The copper powder desirably contains 0.30 wt % or less of the phosphorus element. The copper powder more desirably contains 0.24 wt % or less of the phosphorus element. No element other than the phosphorus element is desirably added to the copper powder.

Abstract: This invention relates to a method of evaluating a squeegeeing property of powder for lamination shaping by stable criteria. In this method, the squeegeeing property is evaluated using at least a satellite adhesion ratio of the powder and an apparent density of the powder. The satellite adhesion ratio is the ratio of the number of particles on which satellites are adhered to the number of all particles. If the satellite adhesion ratio is equal to or less than 50%, and the apparent density is equal to or more than 3.5 g/cm3, the squeegeeing property is evaluated as that the powder can be spread into a uniform powder layer in the lamination shaping. Furthermore, if the 50% particle size of a powder obtained by a laser diffraction method is 3 to 250 ?m, the squeegeeing property is evaluated as that the powder can be spread into a uniform powder layer in the lamination shaping.

Abstract: This invention relates to a method of evaluating powder for lamination shaping by stable criteria. In this method, it is evaluated whether powder for lamination shaping can be spread into a uniform powder layer in the lamination shaping, wherein the powder is evaluated using, as a flowability of the powder, an adhesive force of the powder calculated from a failure envelope obtained by a shear test. The shear test is conducted by a powder rheometer, and the adhesive force is obtained from the relationship between a normal stress and a shearing stress at the powder rheometer. If the adhesive force is 0.450 kPa or less, the powder is evaluated to be spread into a uniform powder layer in the lamination shaping. Furthermore, if at least one of that the 50% particle size of the powder obtained by a laser diffraction method is 3 to 250 ?m and that the apparent density of the powder is 3.5 g/cm3 or more is satisfied, the powder is evaluated to be spread into a uniform powder layer in the lamination shaping.

Abstract: The present invention provides a laminating and shaping copper powder capable of shaping a laminated and shaped object of copper having a high electrical conductivity of, for example, 80% IACS or more. The present invention is a laminating and shaping copper powder obtained by mixing a nano-oxide of equal to or more than 0.01 wt % and equal to or less than 0.20 wt % and a pure copper powder. There is also provided a laminated and shaped object using the laminating and shaping copper powder of the present invention. There are also provided a manufacturing method of the laminated and shaped object using the laminating and shaping copper powder of the present invention and a laminating and shaping apparatus using the laminating and shaping copper powder.

Abstract: A surface treated copper foil includes: a copper foil; a finely roughened particle treatment layer of copper on at least one surface of the copper foil, the finely roughened particle treatment layer including fine copper particles having a particle size of 40 to 200 nm; a heat resistance treatment layer containing nickel on the finely roughened particle treatment layer; a rust prevention treatment layer containing at least chromium on the heat resistance treatment layer; and a silane coupling agent treatment layer on the rust prevention treatment layer. An amount of nickel attached in the heat resistance treatment layer is 30 to 60 mg/m2.

Abstract: A metal powder for additive manufacturing includes: not less than 0.2 mass % and not more than 1.3 mass % of aluminum; and a balance including copper and an incidental impurity.

Abstract: A sliding member of the present invention includes a base material and a coating layer that is formed on the base material. The coating layer includes a particle aggregate, and the particle aggregate contains two or more kinds of precipitation hardened copper alloy particles that have different compositions. The sliding member has high coating strength and superior wear resistance.

Abstract: A laminate includes a base substrate, and a coating layer formed on the base substrate. The coating layer includes a copper alloy portions derived from precipitation-hardening copper alloy particles and hard particle portions which are harder than the copper alloy portions, the hard particle portions are derived from hard particles, and the parts bond with each other via an interface. Each of the hard particle portions has a non-spherical shape. A sliding member includes the laminate in at least one sliding portion. A method for manufacturing a laminate includes a step of spraying a mixture in a non-molten state including precipitation-hardening copper alloy particles and hard particles having a non-spherical shape and being harder than the copper alloy particles onto a base substrate, to form a coating layer on the base substrate.

Abstract: A sliding member of the present invention includes a base material and a coating layer that is formed on the base material. The coating layer includes a particle aggregate that contains precipitation hardened copper alloy particles. The precipitation hardened copper alloy particles contain cobalt (Co) and silicon (Si) The sliding member has high coating strength and superior wear resistance.

Abstract: A laminate includes a base substrate, and a coating layer formed on the base substrate. The coating layer includes a copper alloy portions derived from precipitation-hardening copper alloy particles and hard particle portions which are harder than the copper alloy portions, the hard particle portions are derived from hard particles, and the parts bond with each other via an interface. Each of the hard particle portions has a non-spherical shape. A sliding member includes the laminate in at least one sliding portion. A method for manufacturing a laminate includes a step of spraying a mixture in a non-molten state including precipitation-hardening copper alloy particles and hard particles having a non-spherical shape and being harder than the copper alloy particles onto a base substrate, to form a coating layer on the base substrate.

Abstract: A metal powder for additive manufacturing includes: not less than 0.2 mass % and not more than 1.3 mass % of aluminum; and a balance including copper and an incidental impurity.

Abstract: A sliding member includes a base substrate and a coating layer formed on the base substrate. The coating layer includes a copper alloy part derived from a plurality of precipitation hardening copper alloy particles. The copper alloy parts are bonded to each other via interfaces between the copper alloy parts. The copper alloy part contains nickel and silicon as additive elements. The copper alloy part contains 2 to 5 percent by mass of nickel. A sliding member for an internal combustion engine includes the sliding member at a sliding part of the internal combustion engine.

Abstract: A hard rolled-copper foil which, when heated and laminated on an insulating resin base material, can exhibit excellent bend-resistance characteristics without increasing a final reduction ratio, which, being not prone to develop rolling marks, can maintain a low surface coarseness and can therefore be preferably used in a flexible printed wiring board having excellent high-speed transmission characteristics, which is not prone to softening at room temperature, and which provides excellent operation efficiency and foil passing property when being processed into a flexible printed wiring board after having been stored. A hard rolled-copper foil in which a crystal orientation density in a copper orientation is not less than 10, and a crystal orientation density in a brass orientation is not less than 20.

Abstract: This invention relates to a method of evaluating powder for lamination shaping by stable criteria. In this method, it is evaluated whether powder for lamination shaping can be spread into a uniform powder layer in the lamination shaping, wherein the powder is evaluated using, as a flowability of the powder, an adhesive force of the powder calculated from a failure envelope obtained by a shear test. The shear test is conducted by a powder rheometer, and the adhesive force is obtained from the relationship between a normal stress and a shearing stress at the powder rheometer. If the adhesive force is 0.450 kPa or less, the powder is evaluated to be spread into a uniform powder layer in the lamination shaping. Furthermore, if at least one of that the 50% particle sin of the powder obtained by a laser diffraction method is 3 to 250 ?m and that the apparent density of the powder is 3.5 g/cm3 or more is satisfied, the powder is evaluated to be spread into a uniform powder layer in the lamination shaping.

Abstract: A method for producing a laminated member includes a step of spraying a mixture in a non-molten state including a plurality of precipitation hardening copper alloy particles and a plurality of hard particles that have non-spherical shapes having a median aspect ratio of equal to or more than 1.2 and are harder than the copper alloy particles onto a base substrate to form a coating layer on the base substrate.

Abstract: This invention relates to a method of evaluating a squeegeeing property of powder for lamination shaping by stable criteria. In this method, the squeegeeing property is evaluated using at least a satellite adhesion ratio of the powder and an apparent density of the powder. The satellite adhesion ratio is the ratio of the number of particles on which satellites are adhered to the number of all particles. If the satellite adhesion ratio is equal to or less than 50%, and the apparent density is equal to or more than 3.5 g/cm3, the squeegeeing property is evaluated as that the powder can be spread into a uniform powder layer in the lamination shaping. Furthermore, if the 50% particle size of a powder obtained by a laser diffraction method is 3 to 250 ?m, the squeegeeing property is evaluated as that the powder can be spread into a uniform powder layer in the lamination shaping.

Abstract: A hard rolled-copper foil which, when heated and laminated on an insulating resin base material, can exhibit excellent bend-resistance characteristics without increasing a final reduction ratio, which, being not prone to develop rolling marks, can maintain a low surface coarseness and can therefore be preferably used in a flexible printed wiring board having excellent high-speed transmission characteristics, which is not prone to softening at room temperature, and which provides excellent operation efficiency and foil passing property when being processed into a flexible printed wiring board after having been stored. A hard rolled-copper foil in which a crystal orientation density in a copper orientation is not less than 10, and a crystal orientation density in a brass orientation is not less than 20.