Patents Assigned to FUNAI ELECTRIC HOLDINGS CO., LTD.
  • Patent number: 11708503
    Abstract: An aqueous composition for forming a micro-fluid jet printable dielectric film layer, methods for forming dielectric film layers, and dielectric film layers formed by the method. The aqueous composition includes from about 5 to about 20 percent by 65 weight of a polymeric binder emulsion, from about 10 to about 30 percent by weight of a humectant, from about 0 to about 3 percent by weight of a surfactant, and an aqueous carrier fluid. The aqueous composition has a viscosity ranging from about 2 to about 6 centipoise at a temperature of about 23° C.
    Type: Grant
    Filed: May 28, 2020
    Date of Patent: July 25, 2023
    Assignee: FUNAI ELECTRIC HOLDINGS CO., LTD.
    Inventors: Xiaorong Cai, Michael John Dixon, Yimin Guan, Ann P. Holloway, Jeanne Marie Saldanha Singh, Zhigang Xiao