Abstract: A thermocouple structure according to one aspect of the present disclosure includes a first element wire, second element wires formed of a material different from the first element wire, an insulating covering member covering at least one of the first element wire and the second element wires, and a protective tube accommodating the first element wire and the second element wire. Each of the second element wires is bonded to a different position on the first element wire.
Type:
Grant
Filed:
August 31, 2020
Date of Patent:
November 14, 2023
Assignees:
Tokyo Electron Limited, Furüya Metal Co., Ltd.
Inventors:
Hisashi Inoue, Masahiro Kobayashi, Yasuaki Kikuchi, Tatsuya Yamaguchi, Koji Yoshii, Kensuke Morita, Jun Itabashi